Patents Assigned to PERASO TECHNOLOGIES, INC.
  • Patent number: 10243635
    Abstract: A method and apparatus for beamforming training using frames is provided. A device generates a frame comprising header data and beamforming data. The beamforming data is organized into units of beamforming training (TRN) fields. The header data comprises numbers indicating: a first type of TRN fields in each of the units of the beamforming data, to be transmitted using same antenna settings used for the header data; a second type of TRN fields in each of the units to be transmitted using different antenna settings than used for the header data; and how the first type of TRN fields are organized into respective groups of the second type of TRN fields in each of the units that are to be consecutively transmitted using same respective antenna settings, the respective antenna settings changing with each successive group of the third number of the second type of TRN fields.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: March 26, 2019
    Assignee: PERASO TECHNOLOGIES INC.
    Inventors: Christopher James Hansen, Gary Cheng, Joseph Andonieh, Bradley Robert Lynch
  • Patent number: 10236964
    Abstract: A method and apparatus for beamforming training in basic service set discovery is provided. Beacon data is transmitted from a first wireless communication device, the beacon data comprising: beacon data parameters for operation of a basic service set: and beamforming data that includes receive beamforming training fields. Beamforming occurs with a second wireless communication device that receives beacon data.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: March 19, 2019
    Assignee: PERASO TECHNOLOGIES INC.
    Inventors: Joseph Andonieh, Bradley Robert Lynch, Gary Cheng, Christopher James Hansen
  • Patent number: 10171183
    Abstract: A method in a wireless communications assembly having an antenna, a transceiver and a baseband processor, includes: at the transceiver: receiving, from the antenna, a modulated carrier signal having a carrier frequency and containing payload data; demodulating the carrier signal to extract a baseband signal having a baseband frequency and containing the payload data; generating from the baseband signal, at a converter, a digital baseband signal containing the payload data; at an encoder: receiving the digital baseband signal from the converter; generating an encoded digital baseband signal encoding the payload data for transmission at an operating frequency; the encoded digital baseband signal having at least a threshold proportion of signal level transitions that, when transmitted at the operating frequency, have transition frequencies outside a predefined restricted frequency band; and transmitting the encoded digital baseband signal to the baseband processor via an interface at the operating frequency.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: January 1, 2019
    Assignee: PERASO TECHNOLOGIES INC.
    Inventors: Alexander Tomkins, Grigori Temkine, Bradley Robert Lynch, Craig Farnsworth
  • Patent number: 10153548
    Abstract: A wireless communication assembly includes: a primary support member defining a primary mounting surface with first and second electrical contacts; an antenna, adjacent to primary mounting surface perimeter, and a baseband controller, on the primary support member; primary signal paths between the baseband controller and the first contacts; primary feed lines between the second contacts and the antenna; a secondary support member carrying a radio controller and defining a secondary mounting surface with third electrical contacts and ports adjacent to a perimeter of the secondary mounting surface; secondary signal paths between the third contacts and the radio controller; secondary feed lines between the radio controller and the ports; the secondary mounting surface configured to engage with the primary mounting surface to connect the first contacts with the third contacts, and the second contacts with the ports.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: December 11, 2018
    Assignee: PERASO TECHNOLOGIES INC.
    Inventor: Atabak Rashidian
  • Patent number: 10135550
    Abstract: A calibration signal is transmitted from a transmitter antenna. A receiver antenna receives a loopback signal that results from an air coupling of the receiver antenna and the transmitter antenna. The loopback signal is compared to a target. If the loopback signal does not meet the target, then a gain of the calibration signal is adjusted and the loopback signal is again checked against the target. When the loopback signal meets the target, the gain is taken as a calibrated transmitter gain.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: November 20, 2018
    Assignee: PERASO TECHNOLOGIES INC.
    Inventors: Gary Cheng, Bradley Robert Lynch
  • Patent number: 10110273
    Abstract: A wireless communication assembly stores configuration parameter sets for predefined spectral masks, including: a single channel mask for a base channel bandwidth, and defining target power levels for each of a base in-band bandwidth, base transition bandwidths, and a base floor bandwidth; and a bonded channel mask for a multiple of the base channel bandwidth, and defining target power levels for each of a bonded in-band bandwidth equivalent to the sum of the base in-band bandwidth and the base channel bandwidth, and bonded transition and floor bandwidths that are multiples of the base transition and floor bandwidths. A radio controller selects predefined channels each having the base channel bandwidth, for transmitting data to a recipient station; retrieves selected one of the configuration parameter sets based on the number of selected channels; and applies the selected configuration parameter set to data for transmission to the recipient station.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: October 23, 2018
    Assignee: PERASO TECHNOLOGIES INC.
    Inventors: Gary Cheng, Christopher James Hansen, Joseph Andonieh, Bradley Robert Lynch
  • Patent number: 9961774
    Abstract: A wireless communication assembly includes a first support member carrying a baseband processor and a radio processor, and defining a first mounting surface including a first pair of electrical contacts. The first support member has a first pair of electrical connections between the radio processor and the first electrical contacts. The assembly also includes a second support member carrying an antenna and defining a second mounting surface including a second pair of electrical contacts. The second support member has a second pair of electrical connections between the antenna and the second electrical contacts. The second mounting surface is configured to engage the first mounting surface to rigidly couple the first and second support members and to bring the first pair of electrical contacts into contact with the second pair of electrical contacts for electrically connecting the radio processor and the antenna via the first and second pairs of electrical connections.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: May 1, 2018
    Assignee: PERASO TECHNOLOGIES INC.
    Inventor: Marc Supinski
  • Patent number: 9756123
    Abstract: A method and apparatus for group owner (GO) renegotiation are provided. For example, the method and apparatus may be used for GO renegotiation in a wireless personal network (WPAN), for example, a 60-gigahertz (60 GHz) peer-to-peer (P2P) wireless network. The incumbent group owner (e.g., personal base station set (PBSS) control point (PCP)) controls the operation of the group. GO renegotiation can occur, for example, when a newly arriving device (e.g., a prospective group owner) is trying to connect to the PBSS and/or, for example, with PCP rearrangement among members of an existing group. As an example, after the formation of the group, the PCP may want to relinquish the role of being the PCP. A procedure is described for deciding among clients and the PCP which device will assume the role of group owner from the existing PCP in the event the role of group owner is to be reassigned.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: September 5, 2017
    Assignee: PERASO TECHNOLOGIES INC.
    Inventors: Lochan Verma, Bradley R. Lynch
  • Patent number: 9660679
    Abstract: A wireless receiver automatic gain control system includes: a coarse amplification subsystem that receives and amplifies a carrier-modulated signal; a demodulator that generates a baseband signal from the amplified carrier-modulated signal; a fine amplification subsystem that amplifies the baseband signal; and a controller connected to the amplification subsystems. The controller: obtains a unified gain value for the amplification subsystems; based on the unified gain value, selects (i) one of a plurality of coarse gain values defining a set of coarse gain steps each spanning a plurality of unified gain steps, and (ii) one of a plurality of fine gain values defining a set of fine gain steps each spanning a single unified gain step; and sets (i) the gain of the coarse amplification subsystem to the selected coarse gain value, and (ii) the gain of the fine amplification subsystem to the selected fine gain value.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: May 23, 2017
    Assignee: PERASO TECHNOLOGIES INC.
    Inventors: Grigori Temkine, Craig Farnsworth, Arash Tabibiazar, Alexander Tomkins, Bradley Robert Lynch
  • Patent number: 9577340
    Abstract: An antenna apparatus includes a waveguide adapter plate for mounting an antenna flange and an RF system-in-package or other IC package. The waveguide adapter plate comprises a first surface and an opposing second surface and a waveguide flange interface. The waveguide flange interface comprises a waveguide channel section extending between the first surface and the second surface and a set of flange mounting holes extending from the first surface to the second surface. The waveguide adapter plate further includes a plurality of substrate alignment pins extending substantially perpendicular from the second surface.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: February 21, 2017
    Assignee: PERASO TECHNOLOGIES INC.
    Inventors: Mohammad Fakharzadeh, Andrew Charles Andrade, Saman Jafarlou, Bradley Robert Lynch, Mihai Tazlauanu
  • Patent number: 9520635
    Abstract: An apparatus includes an IC package comprising a substrate having a first metal layer, a second metal layer, and a dielectric layer disposed between the first and second metal layers. The IC package further comprises an IC die disposed at a surface of the substrate and comprising RF circuitry. The first metal layer comprises a microstrip feedline extending from a pin of the IC die. The microstrip feedline includes a conductive trace having a probe element at a tip distal from the pin. The first metal layer further comprises a waveguide opening comprising a region surrounding the probe element, the region being substantially devoid of conductive material. The substrate further comprises a plurality of metal vias disposed at the perimeter of the region, the metal vias extending from the first metal layer to the second metal layer.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: December 13, 2016
    Assignee: PERASO TECHNOLOGIES INC.
    Inventors: Mohammad Fakharzadeh, Mihai Tazlauanu
  • Patent number: 9515385
    Abstract: A coplanar waveguide (CPW) apparatus comprises a substrate having a first surface and an opposing second surface. The substrate comprises a metal layer proximate to the first surface. The metal layer comprises a conductive trace comprising a signal line coupled to a launcher element at a first end of the signal line, and a ground plane co-planar with the conductive trace. The ground plane defines a substantially rectangular first region surrounding the launcher element and defining a second region surrounding the signal line, the first and second regions substantially devoid of conductive material. The launcher element has a substantially rectangular shape with a width greater than a width of the signal line at the first end.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: December 6, 2016
    Assignee: PERASO TECHNOLOGIES INC.
    Inventors: Saman Jafarlou, Mohammad Fakharzadeh
  • Patent number: 9425842
    Abstract: A wireless receiver automatic gain control system includes: a coarse amplification subsystem that receives and amplifies a carrier-modulated signal; a demodulator that generates a baseband signal from the amplified carrier-modulated signal; a fine amplification subsystem that amplifies the baseband signal; and a controller connected to the amplification subsystems. The controller: obtains a unified gain value for the amplification subsystems; based on the unified gain value, selects (i) one of a plurality of coarse gain values defining a set of coarse gain steps each spanning a plurality of unified gain steps, and (ii) one of a plurality of fine gain values defining a set of fine gain steps each spanning a single unified gain step; and sets (i) the gain of the coarse amplification subsystem to the selected coarse gain value, and (ii) the gain of the fine amplification subsystem to the selected fine gain value.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: August 23, 2016
    Assignee: PERASO TECHNOLOGIES INC.
    Inventors: Grigori Temkine, Craig Farnsworth, Arash Tabibiazar, Alexander Tomkins, Bradley Robert Lynch
  • Patent number: 9419341
    Abstract: An IC package includes an IC die disposed at a first surface of a substrate, which includes a signal via extending between first and second metal layers. The first metal layer is proximate to the first surface and includes a first coplanar waveguide. The first coplanar waveguide has a first signal line coupling a die bump to the signal via and has a first ground plane co-planar with the first signal line. The second metal layer is proximate to a second surface and includes a second coplanar waveguide that has a second signal line coupling the signal via to a launcher element and has a second ground plane co-planar with the second signal line. The IC package further includes a waveguide channel aperture comprising a region surrounding the launcher element and which is substantially devoid of conductive material and a via fence disposed at a perimeter of the first region.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: August 16, 2016
    Assignee: Peraso Technologies Inc.
    Inventors: Saman Jafarlou, Mohammad Fakharzadeh
  • Publication number: 20160164189
    Abstract: A coplanar waveguide (CPW) apparatus comprises a substrate having a first surface and an opposing second surface. The substrate comprises a metal layer proximate to the first surface. The metal layer comprises a conductive trace comprising a signal line coupled to a launcher element at a first end of the signal line, and a ground plane co-planar with the conductive trace. The ground plane defines a substantially rectangular first region surrounding the launcher element and defining a second region surrounding the signal line, the first and second regions substantially devoid of conductive material. The launcher element has a substantially rectangular shape with a width greater than a width of the signal line at the first end.
    Type: Application
    Filed: March 18, 2014
    Publication date: June 9, 2016
    Applicant: Peraso Technologies, Inc.
    Inventors: Saman Jafarlou, Mohammad Fakharzadeh
  • Patent number: 9257735
    Abstract: An antenna apparatus comprises a lower assembly and an upper assembly, which together forming a cavity to contain an RF circuit device. The upper assembly comprises a waveguide flange interface at an external surface of the upper assembly. The waveguide flange interface comprises a waveguide channel extending from the external surface to an internal surface forming a surface of the cavity. An opening of the waveguide channel at the internal surface is substantially centered about a first centerline of the upper assembly parallel with the external surface and offset from a second centerline of the upper assembly parallel with the external surface, whereby the second centerline perpendicular is to the first centerline. The upper assembly is removably attachable to the lower assembly in either of a first orientation or a second orientation, whereby the second orientation represents a 180 degree rotation of the upper assembly relative to the first orientation.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: February 9, 2016
    Assignee: Peraso Technologies Inc.
    Inventors: Mohammad Fakharzadeh, Mihai Tazlauanu, Bradley R. Lynch, Behzad Biglarbegian
  • Patent number: 9178260
    Abstract: An antenna apparatus comprises a substrate with a microstrip-to-waveguide transition comprising a microstrip feedline extending between a first terminal point and a second terminal point at a first metal layer and comprising a microstrip element and a probe element. The microstrip element includes a connection segment extending from the first terminal point to a second point, a taper segment extending from the second point to a third point, and a continuous-width segment extending from the third point to a fourth point. The probe element extends from the fourth point to the second terminal point and has a width which is narrower than the continuous-width segment. The substrate further includes a waveguide opening comprising a region surrounding the probe element and includes a plurality of metal vias disposed at the perimeter of the waveguide opening and which extend from the first metal layer to the second metal layer.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: November 3, 2015
    Assignee: Peraso Technologies Inc.
    Inventors: Behzad Biglarbegian, Mohammad Fakharzadeh
  • Patent number: 9148819
    Abstract: A sub-frame is generated for each MSDU to be aggregated in an A-MSDU and the sub-frame is stored in place in memory. For each sub-frame, an MSDU descriptor identifying the memory location of the sub-frame is stored in a queue. When a transmit opportunity for an MPDU arises, a DMA engine sequentially transfers the components of sub-frames stored in memory to a PHY layer using a list or other sequence of DMA descriptors obtained from at least a subset of the MSDU descriptors. Thus, these MSDU descriptors allow the aggregation of A-MSDUs to be initiated while the MSDUs are in place in the same memory in which they were initially stored.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: September 29, 2015
    Assignee: Peraso Technologies, Inc.
    Inventors: Bradley R. Lynch, Joseph Andonieh
  • Publication number: 20150270617
    Abstract: An antenna apparatus includes a waveguide adapter plate for mounting an antenna flange and an RF system-in-package or other IC package. The waveguide adapter plate comprises a first surface and an opposing second surface and a waveguide flange interface. The waveguide flange interface comprises a waveguide channel section extending between the first surface and the second surface and a set of flange mounting holes extending from the first surface to the second surface. The waveguide adapter plate further includes a plurality of substrate alignment pins extending substantially perpendicular from the second surface.
    Type: Application
    Filed: March 18, 2014
    Publication date: September 24, 2015
    Applicant: Peraso Technologies, Inc.
    Inventors: Mohammad Fakharzadeh, Andrew Charles Andrade, Saman Jafarlou, Bradley Robert Lynch, Mihai Tazlauanu
  • Publication number: 20150270616
    Abstract: An IC package includes an IC die disposed at a first surface of a substrate, which includes a signal via extending between first and second metal layers. The first metal layer is proximate to the first surface and includes a first coplanar waveguide. The first coplanar waveguide has a first signal line coupling a die bump to the signal via and has a first ground plane co-planar with the first signal line. The second metal layer is proximate to a second surface and includes a second coplanar waveguide that has a second signal line coupling the signal via to a launcher element and has a second ground plane co-planar with the second signal line. The IC package further includes a waveguide channel aperture comprising a region surrounding the launcher element and which is substantially devoid of conductive material and a via fence disposed at a perimeter of the first region.
    Type: Application
    Filed: March 18, 2014
    Publication date: September 24, 2015
    Applicant: Peraso Technologies, Inc.
    Inventors: Saman Jafarlou, Mohammad Fakharzadeh