Patents Assigned to Pfarr Stanztechnik GmbH
  • Patent number: 11712759
    Abstract: A lead-free soldering foil, for connecting metal and/or metal-coated components. allows the setting of a defined connecting-zone geometry and, with pores and/or voids being formed only to a minimal extent, achieves a high-temperature-resistant soldered connection that ensures great reliability even in staged soldering processes and increases the thermal conductivity of the connecting zone. The lead-free soldering foil is constructed so that, in a soft-solder matrix, two or more composite wires are each individually sandwiched by roll cladding between two soft-solder strips, parallel to one another and parallel to the edges of the strips. These composite wires include a core, which contains a higher-melting, stronger metal/metal alloy in comparison with the soft-solder matrix and around which a shell of another metal/metal alloy is arranged, and, after the roll-cladding operation, there is still 5 pm to 15 pm of soft-solder material arranged above and below at least one of the cores.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: August 1, 2023
    Assignee: Pfarr Stanztechnik GmbH
    Inventors: Ralph Maedler, Stephan Reichelt
  • Publication number: 20230027510
    Abstract: A lead-free soldering foil, for connecting metal and/or metal-coated components. allows the setting of a defined connecting-zone geometry and, with pores and/or voids being formed only to a minimal extent, achieves a high-temperature-resistant soldered connection that ensures great reliability even in staged soldering processes and increases the thermal conductivity of the connecting zone. The lead-free soldering foil is constructed so that, in a soft-solder matrix, two or more composite wires are each individually sandwiched by roll cladding between two soft-solder strips, parallel to one another and parallel to the edges of the strips. These composite wires include a core, which contains a higher-melting, stronger metal/metal alloy in comparison with the soft-solder matrix and around which a shell of another metal/metal alloy is arranged, and, after the roll-cladding operation, there is still 5 pm to 15 pm of soft-solder material arranged above and below at least one of the cores.
    Type: Application
    Filed: February 8, 2021
    Publication date: January 26, 2023
    Applicant: Pfarr Stanztechnik GmbH
    Inventors: Ralph MAEDLER, Stephan REICHELT
  • Publication number: 20210154775
    Abstract: The invention relates to a lead-free solder foil for diffusion soldering and to the method for its production, with which method metallic structural parts and/or metallized/metal-coated structural parts, i.e. metallic surface layers of adjacent structural parts, may be bonded to one another. The task of the invention is to provide an economic and environmentally friendly lead-free solder foil that is not hazardous to health for diffusion soldering, with which the structural parts to be soldered can be bonded to one another in such a way, in a process temperature range typical of the soft soldering, i.e. at approximately 240° C. and in soldering times of shorter than 5 minutes, without a subsequent heat treatment and without the exertion of a pressing force during the soldering, that a continuous layer of a high-melting bonding zone is obtained in the form of an intermetallic phase having a remelting temperature of higher than 400° C.
    Type: Application
    Filed: May 9, 2018
    Publication date: May 27, 2021
    Applicant: Pfarr Stanztechnik GmbH
    Inventors: Haneen DAOUD, Angela LOIDOLT, Stephan REICHELT