Abstract: Electrical connection between two faces of a substrate and manufacturing process. The connection is made by a part (46) of a conducting or semi conducting substrate (20) completely surrounded by at least one electrically insulating trench (32, 36, 44). A contact pad (42) is located on the back face (40) and conducting tracks (38) are located on the front face. The connection is made through the substrate itself. Application to the manufacture of circuits, components, sensors, etc.

Abstract: A matrix array of recording heads, wherein each head is independent from another both in terms of its magnetic circuit and excitation conductors. Each individual head has a planar magnetic circuit and an helical coil wrapped around the lower part of the magnetic circuit. The matrix array is collectively fabricated using full thin film technology on non-magnetic substrates. Preferably, the heads are aligned in an oblique lattice with the write gaps aligned along rows and offset by a constant value along columns. Each individual head is connected to the control electronics through interconnects to the backside of the wafer, allowing independent control of the write parameters. The die forming the device is shaped on its edges and top surface to optimize head/medium positioning and minimize wear.