Abstract: A microfluidic device includes a silicon device and a metallic component. The silicon device and the metallic component are attached by preparing a surface of a silicon device to be solderable, preparing a corresponding surface of a metallic component to be solderable, and soldering the prepared surface of the silicon device to the corresponding prepared surface of the metallic component with a solder of a pre-defined composition and thickness to accommodate strain due to co-efficient of thermal expansion (CTE) mismatch between the silicon device and the metallic component.

Abstract: Exemplary embodiments of the present invention are directed to stabilized insulin compositions suitable for use in implantable artificial pancreatic devices. In embodiments, purified insulin may be made more stable by introducing an insulin analog that will form a heterodimer with the purified insulin. For example, a quantity of between ½ to 10% of one of A21 desamido insulin or Lispro may be added to a purified insulin preparation, resulting in a more stable insulin. Various other methods and preparations of stable insulins, and various catheters for delivering insulins from an implantable device to a body are also presented.