Abstract: Proposed is a wafer storage container for accommodating wafers in a storage chamber and, more particularly, a wafer storage container that can effectively block contaminated outside air flowing into the wafer storage container from an external chamber.

Abstract: A wafer storage container according to an embodiment of the present invention comprises: a main body which includes an opening part at the front side thereof, and in which a wafer is accommodated; and an air current control part provided at one side of the main body, and the air current control part comprises a body the inside of which is empty; a compressed gas injection part provided at one side of the body and injecting a compressed gas into the body; and a compressed gas discharge part for discharging the compressed gas inside the body into the outside of the body, wherein the body extends by a predetermined length in a vertical or horizontal direction of the main body, and the main body includes a plurality of spray parts for spraying a purge gas into the inside thereof.

Abstract: Proposed is an EFEM configured to perform wafer transfer between a wafer storage device and process equipment. More particularly, proposed is an EFEM that prevents harmful gases inside a transfer chamber in which wafer transfer is performed from escaping out of the EFEM.

Abstract: The present invention relates to a container for storing a wafer, particularly to a container for storing a wafer in which a plurality of purging areas is vertically partitioned in the interior of a storage chamber, and a purge gas is sprayed into the plurality of purging areas, thereby allowing not only uniform purging of the wafer to be assured but also efficient purging of the wafer without waste of the purge gas to be achieved.

Abstract: Proposed is an EFEM configured to perform wafer transfer between a wafer storage device and process equipment. More particularly, proposed is an EFEM that prevents harmful gases inside a transfer chamber in which wafer transfer is performed from escaping out of the EFEM.

Abstract: Provided is an exhaust system of a wafer treatment device, and the main purpose thereof is to prevent secondary contamination of a wafer by not allowing foreign substances such as process gases and fumes and the like floating in the wafer treatment device to make contact with the wafer in a side storage. The wafer treatment device comprises: a cleaning device for removing foreign substances remaining on a wafer; and an exhaust device comprising first and second main bodies at the lower side of a main body of the wafer treatment device. By not allowing foreign substances such as process gases and fumes and the like floating in the wafer treatment device to make contact with a wafer in a side storage, secondary contamination of the wafer is prevented.

Abstract: The present invention relates to a container for storing a wafer, particularly to a container for storing a wafer in which a plurality of purging areas is vertically partitioned in the interior of a storage chamber, and a purge gas is sprayed into the plurality of purging areas, thereby allowing not only uniform purging of the wafer to be assured but also efficient purging of the wafer without waste of the purge gas to be achieved.

Abstract: The present invention relates to a wafer storage container, more particularly, relates to a wafer storage container comprising a storage chamber forming an independent space separated from the wafer storage container, and a plurality of gas chambers communicating with the storage chamber, so that the gases are being supplied or exhausted through the area of the side surfaces of the storage chamber via the gas chambers in order to remove the fumes remaining on the surface of a wafer stored inside the wafer storage container efficiently.

Abstract: The present invention relates to a wafer storage container, more particularly, relates to a wafer storage container wherein the space of the wafer storage container is divided into the spaces, namely a storage room, a gas injection room, and a gas exhausting room, which are independent and separate from each other, so when the wafer storage container is transported to the load port and being coupled therewith, the purge gas is injected/exhausted through the separating walls inside the storage room, thereby efficiently removing the remaining fumes on the surface of the wafer.

Abstract: The present invention relates to a wafer storage container, more particularly, relates to a wafer storage container wherein the space of the wafer storage container is divided into the spaces, namely a storage room, a gas injection room, and a gas exhausting room, which are independent and separate from each other, so when the wafer storage container is transported to the load port and being coupled therewith, the purge gas is injected/exhausted through the separating walls inside the storage room, thereby efficiently removing the remaining fumes on the surface of the wafer.

Abstract: The present invention relates to a wafer storage container, more particularly, relates to a wafer storage container comprising a storage chamber forming an independent space separated from the wafer storage container, and a plurality of gas chambers communicating with the storage chamber, so that the gases are being supplied or exhausted through the area of the side surfaces of the storage chamber via the gas chambers in order to remove the fumes remaining on the surface of a wafer stored inside the wafer storage container efficiently,

Abstract: Provided is an exhaust system of a wafer treatment device, and the main purpose thereof is to prevent secondary contamination of a wafer by not allowing foreign substances such as process gases and fumes and the like floating in the wafer treatment device to make contact with the wafer in a side storage. The wafer treatment device comprises: a cleaning device for removing foreign substances remaining on a wafer; and an exhaust device comprising first and second main bodies at the lower side of a main body of the wafer treatment device. By not allowing foreign substances such as process gases and fumes and the like floating in the wafer treatment device to make contact with a wafer in a side storage, secondary contamination of the wafer is prevented.