Patents Assigned to Pink GmbH Thermosysteme
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Patent number: 11998999Abstract: A system for connecting electronic assemblies, in particular a soldering and/or sintering system, has a transport device for conveying the assemblies through the system, with a plurality of gas-tightly separable modules for connecting the assemblies to one another. At least one module is a soldering and/or sintering module and one module is a cooling module. Between the soldering/sintering and the cooling module, a further module is a soft cooling module for cooling between a process temperature of the soldering or sintering module and an intermediate temperature, in particular below a solder solidification temperature. In a soldering or sintering module in a gas-tightly sealable process chamber, in particular in the soft cooling module, at least one heat source is contactable with the assemblies for heating the assemblies and at least one cold trap is arranged, having in operation a surface temperature which is lower than a heat source operating temperature.Type: GrantFiled: May 14, 2021Date of Patent: June 4, 2024Assignee: PINK GMBH THERMOSYSTEMEInventors: Thomas Krebs, Christoph Oetzel
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Patent number: 11676843Abstract: A method and system for connecting electronic assemblies and/or for manufacturing workpieces, having a plurality of modules for connecting the electronic assemblies, includes at least one module configured as a loading station and/or unloading station. At least one further module is configured as a manufacturing station. A manufacturing workpiece carrier is provided for accommodating the electronic assemblies and/or the workpieces, and is movable in automated manner by way of a conveying unit from the loading station via the manufacturing station to the unloading station. The system is configured in particular for assembly line production. In a secondary aspect, a foil/film transfer unit is proposed which provides automated application of foils/films as a process cover in the loading station.Type: GrantFiled: October 2, 2020Date of Patent: June 13, 2023Assignee: PINK GMBH THERMOSYSTEMEInventors: Stefan Müssig, Christoph Oetzel
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Patent number: 11491567Abstract: The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber (74) sealed off from its surroundings by heating and melting solder material (16) which is arranged between the components (12A, 12B) to be connected. It is proposed that the components (12A, 12B) to be connected are provisionally connected with a bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position.Type: GrantFiled: May 7, 2018Date of Patent: November 8, 2022Assignee: PINK GmbH ThermosystemeInventors: Aaron Hutzler, Christoph Oetzel
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Patent number: 11351623Abstract: A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable.Type: GrantFiled: February 10, 2020Date of Patent: June 7, 2022Assignee: PINK GMBH THERMOSYSTEMEInventors: Christoph Oetzel, Sebastian Clärding
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Publication number: 20200180058Abstract: A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable.Type: ApplicationFiled: February 10, 2020Publication date: June 11, 2020Applicant: PINK GMBH THERMOSYSTEMEInventors: Christoph OETZEL, Sebastian CLÄRDING
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Publication number: 20200101549Abstract: The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber (74) sealed off from its surroundings by heating and melting solder material (16) which is arranged between the components (12A, 12B) to be connected. It is proposed that the components (12A, 12B) to be connected are provisionally connected with a bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position.Type: ApplicationFiled: May 7, 2018Publication date: April 2, 2020Applicant: PINK GmbH ThermosystemeInventors: Aaron Hutzler, Christoph Oetzel
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Patent number: 10596649Abstract: A heat transfer device for thermal coupling of a component to be soldered, having a heat source and/or a heat sink in a soldering machine, with at least one base plate which is designed to be in thermal contact at least with the heat source and/or the heat sink. The base plate has a plurality of contact units having a respective contact surface, where the contact surfaces are thermally contactable to the components. The contact units are designed in such a way that the relative distances between the contact surfaces and the surface of the base plate facing the component are changeable. A soldering device, in particular a vacuumable soldering device, is provided having at least one such heat transfer device.Type: GrantFiled: December 9, 2015Date of Patent: March 24, 2020Assignee: PINK GMBH THERMOSYSTEMEInventors: Christoph Oetzel, Sebastian Clärding
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Publication number: 20170326665Abstract: A heat transfer device for thermal coupling of a component to be soldered, having a heat source and/or a heat sink in a soldering machine, with at least one base plate which is designed to be in thermal contact at least with the heat source and/or the heat sink. The base plate has a plurality of contact units having a respective contact surface, where the contact surfaces are thermally contactable to the components. The contact units are designed in such a way that the relative distances between the contact surfaces and the surface of the base plate facing the component are changeable. A soldering device, in particular a vacuumable soldering device, is provided having at least one such heat transfer device.Type: ApplicationFiled: December 9, 2015Publication date: November 16, 2017Applicant: PINK GMBH THERMOSYSTEMEInventors: Christoph OETZEL, Sebastian CLÄRDING
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Patent number: 7878386Abstract: The present invention relates to a method and device (10) for the temperature treatment of workpieces (19) or components, in particular for producing a solder connection between a solder material and at least one component or workpiece used as a solder material carrier by means of melting the solder material arranged on the solder material carrier, where a heating and, in a subsequent method step, a cooling of at least one component is carried out in a process chamber (13, 14) which is sealed from the surrounding area, wherein the heating and the cooling of the component (19) are carried out in two chamber regions (13, 14) of the process chamber (12), which can be separated from one another by means of a condensation device (15).Type: GrantFiled: April 27, 2007Date of Patent: February 1, 2011Assignee: Pink GmbH ThermosystemeInventor: Stefan Weber