Abstract: Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper per deposition. The glycol containing etchant can be utilized to form through holes through the web.

Abstract: Polyetherimide-metal laminates are formed by etching the surfaces of a polyetherimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper deposition. The glycol-containing etchant can be utilized to form through holes through the web.

Abstract: Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper deposition. The glycol-containing etchant can be utilized to form through holes through the web.

Abstract: One or both surfaces of a polyimide sheet are uniformly and completely textured and can be coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers can be strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion.

Abstract: Both surfaces of a polyimide sheet are coated with a layer of electroless nickel or cobalt and can also be coated with a thin electroless copper layer on the Ni. or Co. This tenaciously bonded coating is subsequently treated in such a way so as to increase its permeability or porosity without substantially altering its resistive properties. The induced porosity allows water and other volatiles trapped in the dielectric polyimide sheet to be removed while the preserved electrical continuity of the metal layer is sufficient to support electrolytic copper plating which serves the dual purpose of providing a copper thickness useful for the subsequent production of electronic circuitry and preventing the readsorption of water into the dielectric core by permanently sealing or coating the porous metal layer.

Abstract: Bath surfaces of a polyimide sheet are coated with a layer of electroless nickel or cobalt which can also include a thin electroless copper layer on the Ni. or Co. This tenaciously bonded coating is subsequently treated in such a way so as to increase its permeability or porosity without substantially altering its resistive properties. The induced porosity allows water and other volatiles trapped in the dielectric polyimide sheet to be removed while the preserved electrical continuity of the metal layer is sufficient to support electrolytic copper plating which services the dual purpose of providing a copper thickness useful for the subsequent production of electronic circuitry and preventing the readsorption of water into the dielectric core by permanently sealing or coating said porous metal layer.

Abstract: Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion, as well as a modification of IPC test 2.4.9 method E for resistance to thermal cycling.

Abstract: Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion, as well as a modification of IPC test 2.4.9 method E for resistance to thermal cycling.

Abstract: At least one surface of a polyimide sheet surface is coated with copper in the absence of an adhesive. The polyimide surface is treated with a one phase aqueous solution comprising an alkylene diamine; an alkali metal hydroxide and a water miscible alcohol to render the surface uniformly and substantially completely textured. The treated surface then is treated with a catalyst, coated with cobalt or nickel and then coated with copper. The laminate produced passes the IPC tests for peel strength and solder float.

Abstract: One or both surfaces of a polyimide sheet are uniformly and completely textured and can be coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The surface is textured by contacting the polyimide sheet with a one-phase solution of an amine, an alkali metal hydroxide, a water miscible alcohol and water. The copper and nickel or cobalt layers of the laminate can be strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion.

Abstract: One or both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion.

Abstract: A multilayered composite product useful as an electrical circuit is produced by coating a base with a photoimagable resin free of catalyst or catalyst activator for electroless metal deposition. The resin is patterned by exposure to a desired light, through a mask followed by development. The patterned cured resin is selectively chemically modified while avoiding chemical modification of the base to render the cured resin receptive to a metal catalyst. The metal catalyst which promotes subsequent electroless metal deposition is selectively absorbed on the patterned cured resin and is converted to a catalytically active form. A conductive metal then is deposited selectively on the catalyst-containing patterned cured resin.

Abstract: A resonant tag circuit is provided which is useful in conjunction with an electronic security system for preventing theft of articles from a protected area. The tag circuit comprises an electrically insulating substrate having a spiral conductive path on each surface of the substrate. The spiral conductive paths are positioned to overlap each other to effect distributed capacitance. The degree of overlap of the distributed capacitance portion of the conductive paths is such that it provides at least 70%, preferably 90% and most preferably 100% of the total overlapping portions of the circuit.

Abstract: A process is provided for fabricating metallic patterns such as resonant RF-tuned circuits on a polyolefin film such as polyethylene or polypropylene film. The film is processed under conditions such as to maintain its mechanical integrity by being passed through a solvent plasticizing bath, an etch bath to provide attraction sites and adhesion for catalytic metal deposition, a conditioning bath to improve catalyst adhesion and a catalyst bath to deposit a catalytic metal for electroless metal deposition. A negative image is printed on the film and an electroless metal deposit followed by an electrolytic metal plate are applied to the film to produce the desired metallic patterns. Optionally, prior to the printing step, an electroless metal deposit, with or without a thin electrolytic metal plate, can be applied to the total film surface. Thereafter, a negative or positive printed image is coated on the film.

Abstract: A multilayered composite product including a base, a patterned cured resin bonded to the base and an applied metal layer selectively bonded to the patterned cured resin. The product is useful as an electrical circuit.