Patents Assigned to Polytronics Technology Corp.
  • Publication number: 20130176655
    Abstract: An over-current protection device includes a resistive device, an insulation layer, an electrode layer and at least one electrically conductive connecting member. The resistive device includes a first electrode foil, a second electrode foil and a positive temperature coefficient (PTC) material layer laminated between the electrode foils. The insulation layer is formed on the surface of the first electrode foil, and the electrode layer is formed on the surface of the insulation layer. The conductive connecting member penetrates the electrode layer, the insulation layer and the first electrode foil for electrically connecting the electrode layer and the first electrode foil. The conductive connecting member is insulated from the second electrode foil. One of the first and second electrode foils is configured to electrically connect to a protective circuit module (PCM), and the other one is configured to electrically connect to an electrode terminal of a battery to be protected.
    Type: Application
    Filed: January 6, 2012
    Publication date: July 11, 2013
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Chun Teng TSENG, Yi Nuo Chen, David Shau Chew Wang
  • Patent number: 8482373
    Abstract: An over-current protection device comprises a PTC material layer, first and second conductive layers, first and second electrodes, and four conductive vias. The first and second conductive layers are in physical contact with first and second surfaces of the PTC material layer, respectively. The first electrode contains a pair of first metal foils, and the second electrode contains a pair of second metal foils. The four conductive vias are formed at the corners each defined by two adjacent planar lateral surfaces. Two conductive vias connect the pair of the first metal foils and the first conductive layer, and the other two conductive vias connect the pair of the second metal foils and the second conductive layer. The ratio of the sum of the cross-sectional areas of the conductive vias to a form factor area of the device is in the range of 7% to 20%.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: July 9, 2013
    Assignee: Polytronics Technology Corp.
    Inventors: Chun Teng Tseng, David Shau Chew Wang
  • Patent number: 8461956
    Abstract: An over-current protection device includes a first conductive member, a second conductive member, a resistive device and a temperature sensing switch. The first conductive member includes a first electrode foil and a second electrode foil those are formed on a same plane. The resistive device is laminated between the first conductive member and the second conductive member and exhibits positive temperature coefficient or negative temperature coefficient behavior. The temperature sensing switch can switch the first electrode foil and the second electrode foil between electrically conductive status and current-restriction status, e.g., open circuit, according to temperature variation. The threshold temperature of the temperature sensing switch is lower than the trip temperature of the resistive device.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: June 11, 2013
    Assignee: Polytronics Technology Corp.
    Inventors: Chun Teng Tseng, David Shau Chew Wang
  • Patent number: 8446245
    Abstract: An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volume resistivity between 0.07 ?-cm and 0.32 ?-cm. The PTC material layer includes a crystalline polymer, a conductive ceramic carbide filler of a particle size between 0.1 ?m and 50 ?m and a volume resistivity less than 0.1 ?-cm, and a carbon black filler. The weight ratio of the carbon black filler to the conductive ceramic carbide filler is between 1:90 and 1:4. The conductive ceramic carbide filler and the carbon black filler are dispersed in the crystalline polymer. The resistance ratio R100/Ri is between 3 and 20.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: May 21, 2013
    Assignee: Polytronics Technology Corp.
    Inventors: David Shau Chew Wang, Yi An Sha, Kuo Chang Lo, Tai Kuang Hei
  • Patent number: 8432247
    Abstract: An over-current protection device includes a first electrode layer, a second electrode layer, and a resistance material disposed between the first and second electrode layers. The first electrode layer includes a first groove pattern formed on and through the first electrode layer. The first groove pattern is configured to separate the first electrode layer into a plurality of connected regions. The second electrode layer includes a second groove pattern formed on and through the second electrode layer. The second groove pattern is configured to separate the second electrode layer into a plurality of connected regions. The first and second groove patterns are further configured to be formed in an interlaced manner that when the first and second electrode layers are overlapped, the first and second groove patterns form a plurality of independent regions, which divide the resistance material into a plurality of electrically isolated and parallel connected units.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: April 30, 2013
    Assignee: Polytronics Technology Corp.
    Inventors: David Shau Chew Wang, Chun Teng Tseng
  • Patent number: 8421584
    Abstract: An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: April 16, 2013
    Assignee: Polytronics Technology Corp.
    Inventors: Tong Cheng Tsai, Yi An Sha, David Shau Chew Wang, Fu Hua Chu
  • Publication number: 20130070381
    Abstract: An over-current protection device includes a first substrate, a second substrate, a first grating electrode, a second grating electrode and a positive temperature coefficient (PTC) material layer. The first grating electrode and the second grating electrode are formed on the first substrate and are interlaced and spaced on a same plane. The PTC material layer is formed on the first substrate, the first grating electrode and the second grating electrode, and between the first grating electrode and the second grating electrode. In an embodiment, the first grating electrode and the second grating electrode serve as a current input port and a current output port, respectively.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 21, 2013
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Yi An SHA, David Shau Chew Wang
  • Publication number: 20130070380
    Abstract: An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volume resistivity between 0.07 ?-cm and 0.32 ?-cm. The PTC material layer includes a crystalline polymer, a conductive ceramic carbide filler of a particle size between 0.1 ?m and 50 ?m and a volume resistivity less than 0.1 ?-cm, and a carbon black filler. The weight ratio of the carbon black filler to the conductive ceramic carbide filler is between 1:90 and 1:4. The conductive ceramic carbide filler and the carbon black filler are dispersed in the crystalline polymer. The resistance ratio R100/Ri is between 3 and 20.
    Type: Application
    Filed: September 19, 2011
    Publication date: March 21, 2013
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: David Shau Chew WANG, Yi An Sha, Kuo Chang Lo, Tai Kuang Hei
  • Publication number: 20130062045
    Abstract: A heat-conductive dielectric polymer material includes a thermosetting epoxy resin, a nonwoven fiber component, a curing agent and a heat-conductive filler. The thermosetting epoxy resin is selected from the group consisting of end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-functional epoxy resin or the mixture thereof. The thermosetting epoxy resin comprises 4%-60% by volume of the heat-conductive dielectric polymer material. The curing agent is configured to cure the thermosetting epoxy resin at a curing temperature. The heat-conductive filler comprises 40%-70% by volume of the heat-conductive dielectric polymer material. The nonwoven fiber component comprises 1%-35% by volume of the heat-conductive dielectric polymer material. The heat-conductive dielectric polymer material has a thermal conductivity greater than 0.5 W/mK.
    Type: Application
    Filed: September 14, 2011
    Publication date: March 14, 2013
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: FU HUA CHU, DAVID SHAU CHEW WANG, YI AN SHA, KUO HSUN CHEN
  • Publication number: 20130021704
    Abstract: An over-current and over-temperature protection device includes a first conductive member, a second conductive member, a resistive device, at least one current input electrode and at least two current output electrodes. The first conductive member has a current input portion and a first insulative portion restricting current to only input through the current input portion, and the second conductive member has two or more current output portions and a second insulative portion restricting current to only output through the current output portions, in which the current output portions are electrically isolated by the second insulative portion. The resistive device is laminated between the first conductive member and the second conductive member. The current input electrode is electrically connected to the current input portion, and current output electrodes are electrically connected to the current output portions individually.
    Type: Application
    Filed: July 20, 2011
    Publication date: January 24, 2013
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Chun Teng TSENG, David Shau Chew Wang
  • Publication number: 20130021703
    Abstract: An over-current protection device includes a first conductive member, a second conductive member, a resistive device and a temperature sensing switch. The first conductive member includes a first electrode foil and a second electrode foil those are formed on a same plane. The resistive device is laminated between the first conductive member and the second conductive member and exhibits positive temperature coefficient or negative temperature coefficient behavior. The temperature sensing switch can switch the first electrode foil and the second electrode foil between electrically conductive status and current-restriction status, e.g., open circuit, according to temperature variation. The threshold temperature of the temperature sensing switch is lower than the trip temperature of the resistive device.
    Type: Application
    Filed: July 20, 2011
    Publication date: January 24, 2013
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: David Shau Chew Wang, Chun Teng Tseng
  • Publication number: 20120182118
    Abstract: An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.
    Type: Application
    Filed: January 17, 2012
    Publication date: July 19, 2012
    Applicant: Polytronics Technology Corp.
    Inventors: Tong Cheng Tsai, Yi An Sha, David Shau Chew Wang, Fu Hua Chu
  • Patent number: 8198642
    Abstract: A light emitting diode (LED) apparatus with temperature control and current regulation functions is provided. The LED apparatus includes at least one LED die and at least one temperature control and current regulation (TCCR) device. The TCCR device is electrically connected between the LED die and a power source, and is placed within an effective temperature sensing distance of the LED die, so as to sense temperature changes of the LED die. The resistance of the TCCR device is proportional to the temperature in a range of 25° C. to 85° C., i.e., the resistance increases with temperature. Moreover, the resistance difference of the TCCR device between 50° C. and 80° C. is greater than or equal to 100 m?.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: June 12, 2012
    Assignee: Polytronics Technology Corp.
    Inventors: David Shau Chew Wang, Jyh Ming Yu
  • Publication number: 20120075762
    Abstract: An over-current protection device includes a first electrode layer, a second electrode layer, and a resistance material disposed between the first and second electrode layers. The first electrode layer includes a first groove pattern formed on and through the first electrode layer. The first groove pattern is configured to separate the first electrode layer into a plurality of connected regions. The second electrode layer includes a second groove pattern formed on and through the second electrode layer. The second groove pattern is configured to separate the second electrode layer into a plurality of connected regions. The first and second groove patterns are further configured to be formed in an interlaced manner that when the first and second electrode layers are overlapped, the first and second groove patterns form a plurality of independent regions, which divide the resistance material into a plurality of electrically isolated and parallel connected units.
    Type: Application
    Filed: September 19, 2011
    Publication date: March 29, 2012
    Applicant: Polytronics Technology Corp.
    Inventors: David Shau Chew Wang, Chun Teng Tseng
  • Patent number: 8044763
    Abstract: A surface-mounted over-current protection device with positive temperature coefficient (PTC) behavior is disclosed. The surface-mounted over-current protection device comprises a first metal foil, a second metal foil corresponding to the first metal foil, a PTC material layer stacked between the first metal foil and the second metal foil, a first metal electrode, a first metal conductor electrically connecting the first metal foil to the first metal electrode, a second metal electrode corresponding to the first metal electrode, a second metal conductor electrically connecting the second metal foil to the second metal electrode, and at least one insulated layer to electrically insulate the first metal electrode from the second metal electrode. The surface-mounted over-current protection device, at 25° C., indicates that a hold current thereof divided by the product of a covered area thereof and the number of the conductive composite module is at least 0.16 A/mm2.
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: October 25, 2011
    Assignee: Polytronics Technology Corp.
    Inventors: Shau Chew Wang, Fu Hua Chu
  • Publication number: 20110217462
    Abstract: A method for manufacturing an insulated heat conductive substrate comprises the steps of: performing hydrolysis and condensation of at least one thermally conductive ceramic powder to prepare at least one modified thermally conductive ceramic powder, which comprises a plurality of modified powder particles, each grafted with an organic material; mixing the at least one modified thermally conductive ceramic powder with two substantially mutually soluble polymers to achieve a uniform mixture; blending the uniform mixture with a curing agent to obtain a melt extrudable dielectric curable material; extruding the dielectric curable material through a slit to form a sheet-like substrate; and disposing a first film and a second film on two side surfaces of the substrate to obtain an insulated heat conductive substrate, wherein each of the first and second films can be either a metal foil or a release film.
    Type: Application
    Filed: May 12, 2011
    Publication date: September 8, 2011
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: DAVID SHAU CHEW WANG, YI AN SHA, KUO HSUN CHEN
  • Publication number: 20110214852
    Abstract: A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K.
    Type: Application
    Filed: May 17, 2011
    Publication date: September 8, 2011
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: DAVID SHAU CHEW WANG, YI AN SHA, KUO HSUN CHEN
  • Patent number: 7817009
    Abstract: An LED apparatus with temperature self-regulating, over-temperature protection, and over-current protection function comprises an LED chip, a heat dissipation plate, a heat conductive layer and a temperature control device. The heat dissipation and the heat conductive layer disposed thereon carry the LED chip and dissipate the heat generated from the LED chip that is connected to an electric power source for luminance. The temperature control device exhibiting PTC behavior is electrically connected between the LED chip and the electric power source in series, and the distance between the LED chip and the temperature control device is less than 3 cm. The heat conductive layer can consist of polymeric dielectric material and has a heat conduction coefficient larger than 1.0 W/mK at 25° C.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: October 19, 2010
    Assignee: Polytronics Technology Corp.
    Inventors: Shau Chew Wang, Jyh Ming Yu
  • Publication number: 20100134942
    Abstract: A surface-mounted over-current protection device with positive temperature coefficient (PTC) behavior is disclosed. The surface-mounted over-current protection device comprises a first metal foil, a second metal foil corresponding to the first metal foil, a PTC material layer stacked between the first metal foil and the second metal foil, a first metal electrode, a first metal conductor electrically connecting the first metal foil to the first metal electrode, a second metal electrode corresponding to the first metal electrode, a second metal conductor electrically connecting the second metal foil to the second metal electrode, and at least one insulated layer to electrically insulate the first metal electrode from the second metal electrode. The surface-mounted over-current protection device, at 25° C., indicates that a hold current thereof divided by the product of a covered area thereof and the number of the conductive composite module is at least 0.16 A/mm2.
    Type: Application
    Filed: February 5, 2010
    Publication date: June 3, 2010
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Shau Chew WANG, Fu Hua CHU
  • Patent number: RE44224
    Abstract: A surface-mounted over-current protection device with positive temperature coefficient (PTC) behavior is disclosed. The surface-mounted over-current protection device comprises a first metal foil, a second metal foil corresponding to the first metal foil, a PTC material layer stacked between the first metal foil and the second metal foil, a first metal electrode, a first metal conductor electrically connecting the first metal foil to the first metal electrode, a second metal electrode corresponding to the first metal electrode, a second metal conductor electrically connecting the second metal foil to the second metal electrode, and at least one insulated layer to electrically insulate the first metal electrode from the second metal electrode. The surface-mounted over-current protection device, at 25° C., indicates that a hold current thereof divided by the product of a covered area thereof and the number of the conductive composite module is at least 0.16 A/mm2.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: May 21, 2013
    Assignee: Polytronics Technology Corp.
    Inventors: Shau Chew Wang, Fu Hua Chu