Abstract: The manufacturing methodology to produce polycrystalline silicon in time and cost efficient manner uses a spatially selective crystallization approach to greatly reduce the amount of energy delivered to the work surface. The amorphous silicon film is subjected to laser radiation substantially exclusively at localized areas where TFTs are to be formed. The source of radiation is a copper vapor laser which produces a highly stable radiation in a visible spectrum with an energy sufficient to convert amorphous silicon into polysilicon in 1-3 shots. The optic system delivers the homogenized, conditioned and focused laser beam to the area of interest in a controlled manner. Single or multi-laser beam arrangements, as well as different shapes and sizes of laser beam spots are contemplated.

Abstract: A method utilizing spatially selective laser doping for irradiating predetermined portions of a substrate of a semiconductor material is disclosed. Dopants are deposited onto the surface of a substrate. A pulsed, visible beam is directed to and preferentially absorbed by the substrate only in those regions requiring doping. Spatial modes of the incoherent beam are overlapped and averaged, providing uniform irradiation requiring fewer laser shots. The beam is then focused to the predetermined locations of the substrate for implantation or activation of the dopants. The method provides for scanning and focusing of the beam across the substrate surface, and irradiation of multiple locations using a plurality of beams. The spatial selectivity, combined with visible laser wavelengths, provides greater efficiency in doping only desired substrate regions, while reducing the amount of irradiation required.

Abstract: A method for forming electrically conductive patterns to provide an electrically conductive path on a polymer tube is provided. The method includes the steps of establishing a polymer tube and mounting such in a displaceable and rotatable mounting that is adapted to provide both axial and rotational motion. This is followed by forming at least one channel having a predetermined pattern in the polymer tube with a focused energy beam, the channel then being filled with an electrically conductive paste or electrically conductive slurry material. The polymer tube is then heated to temperatures less than 250° C. to cure the electrically conductive paste or electrically conductive slurry material. The electrically conductive paste or electrically conductive slurry material is then covered with a polymer layer.

Abstract: A method for manufacturing a modular electrical circuit includes the steps of pre-manufacturing a plurality of components having fine features such as resistors, capacitors, inductances, and conductors formed on a dielectric substrate. The pre-manufactured components are laminated each to the other in a predetermined order. Each pre-manufactured component includes one or more electrical elements of the same type coupled each to the other by conducting lines. Each dielectric substrate includes through vias filled with the conductive material which serve for cross-coupling of the elements of neighboring components. Position of the passive elements, as well as conductive lines and through vias, are pre-designed to allow precise coordination between the elements of different components in the multi-layered modular electrical circuit.

Abstract: A method of forming high resolution electronic circuits (10) on a substrate (12) is provided. The method includes the steps of laminating a dielectric layer (14) on a substrate (12), laser drilling channels (16 and 18) in the dielectric film (14) and the substrate (12), and filling channels (16 and 18) with a filler material (20). Further, a release layer (22) is applied to dielectric film layer (14) and filler material (20), the release layer (22) having an adhesive thereon. Release layer (22) is peeled or otherwise removed from substrate (12), leaving filler material (20) formed and shaped on substrate (12), thus producing a high resolution electronic circuit on substrate (12).

Abstract: A self-identifying integrated circuit contains a primary function circuit and an immutable, unique identification code, which is presented at an output port thereof upon demand by, an external circuit. The unique identification code may be an N bit digital number or may be a response signal to an interrogating excitation signal. The circuitry to store the unique identification code is fabricated on a microscopic scale such as by a direct-write laser forward transfer of material process or by a laser ablation of select material process. The identification storage means may be disposed on a package substrate or on an integrated circuit die and is permanently encased within the integrated circuit package so as to be protected from alteration by external means.

Abstract: A method for manufacturing a modular electrical circuit includes the steps of pre-manufacturing a plurality of components having fine features such as resistors, capacitors, inductances, and conductors formed on a dielectric substrate. The pre-manufactured components are laminated each to the other in a predetermined order. Each pre-manufactured component includes one or more electrical elements of the same type coupled each to the other by conducting lines. Each dielectric substrate includes through vias filled with the conductive material which serve for cross-coupling of the elements of neighboring components. Position of the passive elements, as well as conductive lines and through vias, are pre-designed to allow precise coordination between the elements of different components in the multi-layered modular electrical circuit.

Abstract: Apparatus (10) for performing patterned cleaning of substrate surfaces (11) includes substrate (11), energetic beam (12) directed to the substrate (11), material carrier element (14) having a deposition layer (16), and a control unit (8) operating the apparatus (10) in either a “material removal” or a “material transfer” mode in a predetermined sequence. In the “material removal” mode, the following steps are followed which include the material carrier element (14) from the intersection with the energy beam (12) and allowing impinging of the energy beam (12) on the surface of the substrate in a predetermined patterned fashion so that the material of the substrate is disintegrated at predetermined locations of the substrate surface (11).

Abstract: Pulse-position synchronized deposition of a material in miniature structure manufacturing processes is carried out in a fabrication tool including a material carrier element, a source of energy generating pulses of energy, a substrate, and a control unit operatively coupled to the source of energy, substrate, and the material carrier element. The control unit exposes a first area of the material carrier element to a first pulse of energy, pauses the exposure while initiating relative motion between the source of energy and the substrate at a predetermined first speed and relative motion between the material carrier element and the energy source at a predetermined second speed which is a function of the first speed, and slowing (or stopping) relative motion between the energy source, material carrier element, and the substrate, while exposing the unablated area of the material carrier element adjacent to previously ablated area to a second pulse of energy.

Abstract: A material delivery system is provided for miniature structures fabrication which has a substrate, a material carrier having a deposition layer, and a laser beam directed towards the material carrier element. A control unit is operatively coupled to the substrate, the material carrier element and laser beam for exposing respective areas of the deposition layer to the laser beam in a patterned manner so that the depositable material of the deposition layer is transferred to the substrate surface for deposition on its surface. The system operates in either an additive mode of operation, or a subtractive mode of operation so that a workpiece does not have to be removed from the tool when change of modes of operation takes place.

Abstract: A system for laser marking a gemstone (10) is provided. A pulsed laser (20) generates a laser pulse (40) which is then directed towards a focusing element (60) through optical means (30). Lens (60) focuses the laser pulse into focused pulse (70). The focused pulse (70) is projected onto a surface of gemstone (80) which is mounted in fixture (90). A computer control system (110) allows a user to input and control a predetermined path of displacement between the gemstone (80) and the focused laser pulse (70).

Abstract: An apparatus is provided for fabrication of miniature structures which includes a substrate, a controllable energetic beam, a deposition layer supported on a material carrier element and a control unit operating the apparatus in either of “material removal” and “material transfer” modes of operation. In the “material removal” mode of operation, the control unit displaces the material carrier element away from an interception path with the energetic beam so that the energetic beam impinges in patterned fashion onto the surface of the substrate and disintegrates the surface material of the substrate. In the “material transfer” mode of operation, the control unit displaces the deposition layer to intercept with the energetic beam so that the material contained in the deposition layer is transferred and deposited on the surface of the substrate in a patterned fashion.

Abstract: A gemstone marking system includes a focus sensing unit sensing relative disposition between the marking surface of the gemstone and the focal plane of the laser beam. The focus sensing unit includes a light source emitting a collimated optical beam directed in parallel to the focal plane of the laser beam and overlapping regions positioned in close proximity to the focal plane of the laser beam, an optical detector measuring the power of the sensing optical beam (the power of the sensing optical beam depends on a relative disposition between the marking surface of the gemstone and the focal plane of the laser beam), and a signal processing unit operationally coupled to the output of the optical detector for receiving and processing data corresponding to the relative disposition of the marking surface of the gemstone and the focal plane of the laser beam. The signal processing unit, in response to the data obtained from the optical detector, automatically controls the position of the gemstone.

Abstract: An apparatus is provided for fabrication of miniature structures which includes a substrate, a controllable energetic beam, a deposition layer supported on a material carrier element and a control unit operating the apparatus in either of “material removal” and “material transfer” modes of operation. In the “material removal” mode of operation, the control unit displaces the material carrier element away from an interception path with the energetic beam so that the energetic beam impinges in patterned fashion onto the surface of the substrate and disintegrates the surface material of the substrate. In the “material transfer” mode of operation, the control unit displaces the deposition layer to intercept with the energetic beam so that the material contained in the deposition layer is transferred and deposited on the surface of the substrate in a patterned fashion.

Abstract: Discharge tubes formed of metal fluoride gases are used in apparatus for emitting high frequency laser and fluorescent light. The discharge tubes are resistant to corrosion from halogen-containing gas mixtures subjected to high frequency excitation in the apparatus.

Abstract: A high-power, high-frequency discharge apparatus is disclosed. An electrical wave is guided toward the discharge region by a hollow waveguide that is coupled to a discharge electrode via a waveguide transition element. The waveguide transition element can be formed of various shapes. Obstacles placed in the waveguide provide impedance matching and minimize power reflected back toward the source. The obstacles may be movable to optimize impedance matching.

Abstract: A rare gas halide laser has a hollow discharge tube disposed between two metal electrodes, and a high frequency electrical generator attached to the electrodes. In order to increase the duty factor of the laser, the bore in the discharge tube is formed with two opposing walls which are separated by a small distance, preferably less than 0.5 millimeters, so that the rate of recombination of the halide compound is increased.

Abstract: In a high-frequency discharge apparatus utilizing a discharge tube positioned between an electrode and a ground plane, the electrode is shaped so as to increase the uniformity of the electric field across the discharge tube. Furthermore, a transmission line is formed between a conductor connected to the electrode and the ground plane, and impedance matching in the transmission line is provided by metal and/or dielectric tuning slugs inserted between the conductor and the ground plane.