Abstract: A compact replaceable temperature control module for use with semiconductor manufacturing equipment and a controller to control an operating temperature of an internal surface in a process chamber of the equipment. The control module includes a housing having a size which permits the housing to be placed in close proximity to the equipment. A circulatory system is carried by the housing and adapted to couple to the equipment for receiving a liquid from the equipment and returning the liquid to the equipment so as to create a closed loop system with the equipment for regulating the operating temperature of the internal surface in the process chamber. The circulatory system includes a thermal electric heat exchanger provided with a hollow core element having a temperature different than the unknown temperature and a pump for causing the liquid to flow through the hollow core element so as to cause the temperature of the liquid to more closely approximate the temperature of the hollow core element.