Patents Assigned to President of Tokyo University of Agriculture & Technology
  • Semiconductor element forming process having a step of separating film structure from substrate
    Patent number: 6339010
    Abstract: The invention provides a process of forming a semiconductor device, including the steps of: forming a separation member, used to form a separation layer, on a flat surface of a support substrate; forming support sections on the flat surface by removing portions of the separation member; forming, above the support sections, a film structure having a single layer or a plurality of layers; and separating the film structure from the Support substrate by removing the separation layer.
    Type: Grant
    Filed: September 14, 1998
    Date of Patent: January 15, 2002
    Assignee: President of Tokyo University of Agriculture & Technology
    Inventor: Toshiyuki Sameshima