Abstract: A method of using a high-temperature RFID label includes providing a label. The label includes a pressure-sensitive polymeric material, a liner, and an adhesive located between the pressure-sensitive polymeric material and the liner. An RFID tag is provided. The RFID tag includes an RFID chip or integrated circuit and an antenna. The RFID tag is located at least partially inside of the label to form the high-temperature RFID label. A portion of the liner is removed from the high-temperature RFID label. The high temperature RFID label is attached on a product. The product exceeds a temperature of at least about 300° F. The high-temperature RFID label is located outside of a periphery of the product. The RFID label may further include a printable top layer.