Abstract: Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.

Abstract: Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.

Abstract: Provided is a mask changing unit for a laser bonding apparatus, and more particularly, a mask changing unit for a laser bonding apparatus, wherein the mask changing unit supplies or changes a mask to or in the laser bonding apparatus for bonding a semiconductor chip to a substrate by using a laser beam. According to the mask changing unit for a laser bonding apparatus, a plurality of masks that are used in performing laser bonding of a semiconductor chip to a substrate while the semiconductor chip is being pressed may be easily supplied to the laser bonding apparatus or changed in the laser bonding apparatus.

Abstract: Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.

Abstract: Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.

Abstract: Provided are a flip chip laser bonding apparatus and a flip chip laser bonding method, and more particularly, to an apparatus and method for flip chip laser bonding, in which a semiconductor chip in a flip chip form is bonded to a substrate by using a laser beam. According to the flip chip laser bonding apparatus and the flip chip laser bonding method, even a semiconductor chip that is bent or is likely to bend may also be bonded to a substrate without contact failure of solder bumps by bonding the semiconductor chip to the substrate by laser bonding while pressurizing the semiconductor chip.

Abstract: Provided are a semiconductor chip bonding apparatus and a semiconductor chip bonding method, and more particularly, to an apparatus and method of bonding a semiconductor chip to an upper surface of a substrate or another semiconductor chip. According to the semiconductor chip bonding apparatus and the semiconductor chip bonding method, productivity may be increased by quickly and accurately bonding a semiconductor chip to a substrate or another semiconductor chip.

Abstract: An apparatus for bonding a flexible part including inclined leads is provided, more particularly, an apparatus for bonding a flexible part including inclined leads, which aligns parts to bond the parts is provided. According to the apparatus for bonding a flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.

Abstract: Provided is a wafer level dispenser, and more particularly, a wafer level dispenser having a function of applying a viscous liquid to a semiconductor chip formed on a wafer by approaching the semiconductor chip on the wafer at various angles. According to the wafer level dispenser, a viscous liquid may be dispensed to a wafer or a semiconductor chip mounted on the wafer by adjusting an angle of a pump as desired.

Abstract: Provided are apparatus and method of dispensing an adhesive liquid for a dust trap, in which the adhesive liquid is dispensed to a camera module while effectively cleaning the adhesive liquid that may be smeared on a nozzle, thereby enhancing productivity and quality of a process of forming a dust trap.

Abstract: A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.

Abstract: A piezoelectric dispenser having a uniform dispensing quality of a viscous liquid by calibrating an operation stroke of a valve rod discharging a viscous liquid (vertical operation displacement of the valve rod) by setting the operation stroke of the valve rod to an initial value during use, and a method of calibrating the operation stroke of the piezoelectric dispenser. Accordingly, a uniform dispensing accuracy of viscous liquid may be maintained, and degradation of the dispensing quality of a viscous liquid due to abrasion of components may be reduced.

Abstract: Provided are a pump position feedback type dispenser and dispensing method, in which an image of a work, to which a viscous liquid is to be dispensed, is captured to determine an accurate position and direction of the work, and then a position of a pump is received in real time so as to dispense the viscous liquid to the work while ensuring that the pump reaches the accurate position of the work.

Abstract: A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.

Abstract: Provided are a semiconductor chip bonding apparatus and a semiconductor chip bonding method, and more particularly, to an apparatus and method of bonding a semiconductor chip to an upper surface of a substrate or another semiconductor chip. According to the semiconductor chip bonding apparatus and the semiconductor chip bonding method, productivity may be increased by quickly and accurately bonding a semiconductor chip to a substrate or another semiconductor chip.

Abstract: Provided are a flip chip laser bonding apparatus and a flip chip laser bonding method, and more particularly, to an apparatus and method for flip chip laser bonding, in which a semiconductor chip in a flip chip form is bonded to a substrate by using a laser beam. According to the flip chip laser bonding apparatus and the flip chip laser bonding method, even a semiconductor chip that is bent or is likely to bend may also be bonded to a substrate without contact failure of solder bumps by bonding the semiconductor chip to the substrate by laser bonding while pressurizing the semiconductor chip.

Abstract: An apparatus for bonding a flexible part including inclined leads is provided, more particularly, an apparatus for bonding a flexible part including inclined leads, which aligns parts to bond the parts is provided. According to the apparatus for bonding a flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.

Abstract: Provided is a slurry dispensing apparatus for electromagnetic interference (EMI) shielding, and more particularly, a slurry dispensing apparatus for EMI shielding, wherein the slurry dispensing apparatus dispenses a slurry, in which a conductive metal powder and an adhesive are mixed, to an electronic component to form an electromagnetic wave shielding layer on the electronic component. By using the slurry dispensing apparatus for EMI shielding, the slurry may be dispensed while preventing separation of the metal powder included in the slurry from the adhesive by precipitation, and maintaining a uniform mixture ratio in the slurry.

Abstract: Provided are apparatus and method of dispensing an adhesive liquid for a dust trap, in which the adhesive liquid is dispensed to a camera module while effectively cleaning the adhesive liquid that may be smeared on a nozzle, thereby enhancing productivity and quality of a process of forming a dust trap.

Abstract: A dispensing pump, and more particularly, a valve accelerating type dispensing pump that may be used in a process of manufacturing an electronic product and may dispense an accurate amount of a liquid, such as a liquid synthetic resin, at high speed. The valve accelerating type dispensing pump can descend a valve rod at high speed and thus can dispense a liquid with high viscosity at high speed. The valve accelerating type dispensing pump can dispense an accurate amount of a liquid at high speed. Also, the valve accelerating type dispensing pump can dispense a liquid having high viscosity at high speed due to a fast descending speed of a valve rod.