Abstract: A hybrid electronic sensing component comprises an integrated circuit attached to an analogue circuit into which at least one sensing element has been integrated. The hybrid sensing component provides an output in digital form in response to a quantifiable change in its environmental conditions. The sensing functionality is separated from the data processing, which reduces the effect of self-heating due to the power consumption in the processor.

Abstract: A sensor device comprises an array of spaced apart sensor elements disposed in a pattern on a substrate. Each sensor element is connected electrically so that a physical variable measured by each sensor element independently can be recorded and/or displayed by an external instrument. The sensing device may be a temperature sensing device, in which case the sensor elements are temperature sensing elements such as negative temperature coefficient (NTC) thermistors. Alternatively the sensing device may be a strain or pressure sensing device, or an optical imaging device, in which case the sensor elements include piezoresistors or photoresistors. The sensor elements may be connected in a common source or write all-read one configuration, in a common output or write one-read all configuration, or in an array comprising X rows and Y columns, in a write X-read Y configuration.

Abstract: An electronic device and a method of fabricating an electronic device are disclosed. The device includes a body of semiconductor material, and a conductive material defining at least three conducting contacts to form respective terminals. The semiconductor material and the conducting contacts overlap at least partially to define the device, so that the electrical characteristics of the device between any pair of terminals correspond to those of a varistor. The body of semiconductor material may be a layer deposited by printing or coating. The varistor characteristics between each pair of terminals enable switching of an electrical current between one terminal and any two other terminals in such a manner that when there is a positive current into a first terminal, there is a negligible current through a second terminal at which a positive potential is applied and a positive current out of a third terminal which is held at a negative potential with respect to the second terminal.

Abstract: An electronic component assembly comprises a printed component structure comprising at least one of a semiconducting ink, an insulating ink and a conducting ink deposited onto a substrate. The component structure defining at least one contact area, with a connecting lead disposed against or adjacent to the contact area. At least one layer of electrically insulating material encloses the component structure. At least one of the substrate and the layer of electrically insulating material comprises packaging material. The component structure can be printed on a substrate such as paper or another soft material, which is secured to a layer of insulating packaging material such as polyethylene. Instead, the substrate can be the insulating packaging material itself. Variations using hard and soft substrates are possible, and various examples of electronic component assembly are disclosed.

Abstract: A method of producing a temperature sensing device is provided. The method includes forming at least one silicon layer and at least one electrode or contact to define a thermistor structure. At least the silicon layer is formed by printing, and at least one of the silicon layer and the electrode or contact is supported by a substrate during printing thereof. Preferably, the electrodes or contacts are formed by printing, using an ink comprising silicon particles having a size in the range 10 nanometers to 100 micrometers, and a liquid vehicle composed of a binder and a suitable solvent. In some embodiments the substrate is an object the temperature of which is to be measured. Instead, the substrate may be a template, may be sacrificial, or may be a flexible or rigid material. Various device geometries are disclosed.

Abstract: A sensing device is made up of a network of nominally identical temperature dependent resistors which is topologically equivalent to a square resistor network. The device has terminals at which an average resistance value thereof can be measured. The resistors are supported on a substrate which can be reduced in size from an initial size without substantially changing the average resistance value. In preferred embodiments, a pattern of contacts and conductive tracks joining the contacts are printed on a substrate, and a material having a temperature dependent resistance is applied over the contacts to define a network of interconnected thermistors. Alternatively, the material can be applied to the substrate first and the contacts and tracks printed on it.

Abstract: A strain compensated temperature sensor includes a first, temperature dependent resistor, and a second, substantially temperature independent resistor connected in series with the temperature dependent resistor. At least one electrical contact allows an electrical potential difference to be applied across both resistors simultaneously. Both the temperature dependent resistor and the substantially temperature independent resistor are sensitive to mechanical strain. This permits temperature readings from the sensor to be corrected automatically for mechanical distortion of the sensor. The temperature dependent resistor and the substantially temperature independent resistor are of substantially similar construction, preferably being located adjacent one another in or on a common substrate, and hence have a similar response to a mechanical force applied to them.

Abstract: A sensor device comprises an array of spaced apart sensor elements disposed in a pattern on a substrate. Each sensor element is connected electrically so that a physical variable measured by each sensor element independently can be recorded and/or displayed by an external instrument. The sensing device may be a temperature sensing device, in which case the sensor elements are temperature sensing elements such as negative temperature coefficient (NTC) thermistors. Alternatively the sensing device may be a strain or pressure sensing device, or an optical imaging device, in which case the sensor elements include piezoresistors or photoresistors.

Abstract: A method is provided of producing nanoparticles in the size range 1 nm to 1000 nm through the synthesis of one or more precursor fluids. The method includes providing a fluid medium comprising at least one precursor fluid and generating an electrical spark within said fluid medium to cause pyrolysis of said at least one precursor fluid in a relatively hot plasma zone to produce at least one radical species. Nanoparticles are formed by nucleation in the fluid medium in a cooler reaction zone about the plasma zone, where the radical species acts as a reactant or catalytic agent in the synthesis of material composing the nanoparticles. The spark is created by an electrical discharge having a frequency between 0.01 Hz and 1 kHz, and a total energy between 0.01 J and 10 J. The nanoparticles may comprise silicon, or compounds or alloys of silicon, and are typically useful in electronic and electrical applications.

Abstract: Apparatus for depositing ink on a substrate includes a nozzle defining an outlet for the ink, with at least a portion of the nozzle being electrically conductive. A first voltage source applies a first potential to the outlet nozzle. One or more auxiliary electrodes are located adjacent the outlet nozzle, and a second voltage source applies a second potential to the auxiliary electrodes. The apparatus includes a piezo-electric or thermal actuator for expelling ink from the nozzle towards a target zone on a substrate, the ink comprising a liquid vehicle and pigment particles dispersed in the vehicle. At least the pigment particles are electrically charged, typically due to the applied potentials. In one embodiment, an auxiliary electrode is disposed coaxially around the electrode formed by the nozzle. In another embodiment, an auxiliary electrode located beyond the nozzle, on a common axis with the electrode formed by the nozzle.

Abstract: An electronic component assembly comprises a printed component structure comprising at least one of a semiconducting ink, an insulating ink and a conducting ink deposited onto a substrate. The component structure defining at least one contact area, with a connecting lead disposed against or adjacent to the contact area. At least one layer of electrically insulating material encloses the component structure. At least one of the substrate and the layer of electrically insulating material comprises packaging material. The component structure can be printed on a substrate such as paper or another soft material, which is secured to a layer of insulating packaging material such as polyethylene. Instead, the substrate can be the insulating packaging material itself. Variations using hard and soft substrates are possible, and various examples of electronic component assembly are disclosed.

Abstract: A method and apparatus of producing inorganic semiconducting nanoparticles having a stable surface includes providing an inorganic bulk semiconductor material milled in the presence of a selected reducing agent. The reducing agent acts to chemically reduce oxides of the semiconductor material, or prevent the formation of such oxides to provide semiconducting nanoparticles having a stable surface, allowing electrical contact between the nanoparticles. The milling media and/or one or more components of the mill include the selected reducing agent. The milling media or mill are typically composed of a metal selected from the group comprising iron, chromium, cobalt, nickel, tin, titanium, tungsten, vanadium, and aluminum, or an alloy containing one or more of these metals. Alternatively, the selected reducing agent includes a liquid contained in the mill during milling, which is typically an acidic solution containing any of hydrochloric, sulphuric, nitric, acetic, formic, or carbonic acid, or a mixture thereof.