Abstract: Panel level packaging (PLP) with high positional accuracy of dies. The PLP bonds dies accurately to die bonding regions of an alignment panel. High accuracy is achieved by providing die bonding regions with local alignment marks. Accurate die bonding on the alignment carrier results in a reconstructed wafer with accurate positioning of dies. The dies of the reconstructed wafer can be scanned by a die location check (DLC) scan based on sub-blocks of dies, enabling high DLC throughput. The DLC scan generates a DLC file with coordinate points of sub-blocks of the reconstructed wafer. Also, a laser direct imaging (LDI) file can be generated using sub-block circuit files aligned to the DLC file. The use of sub-block circuit files facilitates high throughput in generating the LDI file with high accuracy due to the reconstructed wafer being formed using the alignment carrier with local alignment marks.

Abstract: A wet processing apparatus and an operation method thereof are provided. The wet processing apparatus includes: a tank body including at least one side wall, the at least one side wall being provided with an opening extending from the inside to the outside of the tank body, and the tank body being configured to accommodate a wet processing solution; and a fixing device configured to fix the substrate at the opening of the side wall. The operation method of the wet processing apparatus includes: placing the substrate on an outer side of the side wall and at the position of the opening, and operating the fixing device to fix the substrate; and performing wet processing treatment on the substrate.

Abstract: Panel level packaging (PLP) with high accuracy and high scalability is disclosed. The PLP includes dies bonded face down onto an alignment carrier configured with die bond regions. Pre-bond and post bond inspection are performed at the carrier level to ensure accurate bonding of the dies to the carrier.

Abstract: A compression molding machine including a base part; a first mold chase fixed in a position spaced apart from the base part; a second mold chase disposed between the base part and the first mold chase, the second mold chase movable along a movement axis extending perpendicularly between the base part and the first mold chase; and a compression actuation arrangement for moving the second mold chase. The compression actuation arrangement including at least two independent actuating units, each having a first inverted wedge member, a second wedge member, and a drive mechanism. An inclined surface of the first inverted wedge member and an inclined surface of the second wedge member is slidably engaged to each other to convert a motion of the second wedge member along the transmission axis to a motion of the first inverted wedge member along the actuation axis for moving the second mold chase.

Abstract: Panel level packaging (PLP) with high accuracy and high scalability is disclosed. The PLP employs an alignment carrier with a low coefficient of expansion which is configured with die regions having local die alignment marks. For example, local die alignment marks are provided for each die attach region. Depending on the size of the panel, it may be segmented into blocks, each with die regions with local die alignment marks. In addition, a block includes an alignment die region configured for attaching an alignment die. Linear and non-linear positional errors are reduced due to local die alignment marks and alignment dies. The use of local die alignment marks and alignment dies results in increase yields as well as scaling, thereby improving throughput and decreasing overall costs.

Abstract: A plating apparatus and an operation method thereof are provided. The plating apparatus includes: a tank body including at least one side wall, the at least one side wall being provided with an opening extending from the inside to the outside of the tank body, and the tank body being configured to accommodate a plating solution; and a fixing device configured to fix the substrate at the opening of the side wall. The operation method of the plating apparatus includes: placing the substrate on an outer side of the side wall and at the position of the opening, and operating the fixing device to fix the substrate; and performing plating treatment on the substrate.

Abstract: An automation line for processing a molded panel which is attached, via thermal release adhesive, to a first carrier. The automation line including a release workstation which includes a release unit having a carrier-engagement arrangement movable to engage the first carrier. The carrier-engagement arrangement includes a heating sub-arrangement to thermally contact the first carrier and an attachment sub-arrangement to attach the first carrier to the carrier-engagement arrangement, wherein the carrier-engagement arrangement is operable to heat the intermediate panel assembly to a release temperature of the thermal release adhesive and to separate the first carrier from the molded panel.