Abstract: Disclosed embodiments relate to integrated circuits, a method to operate an integrated circuit, and a method to determine an electrical erase sequence. More particularly, the application relates to devices having at least two memory cells and methods relating to its operation.

Abstract: Embodiments of the present invention relate to a method to operate an integrated circuit that includes a memory. The memory encompasses a first and a second threshold level. The invention further relates to integrated circuits including a memory with a first and a second threshold level and a method to determine an operating point of an integrated circuit.

Abstract: Embodiments of the invention relate to integrated circuits having a memory cell arrangement and methods of manufacturing thereof. In one embodiment of the invention, an integrated circuit has a memory cell arrangement which includes a fin structure extending in its longitudinal direction as a first direction, including a first insulating layer, a first active region disposed above the first insulating layer, a second insulating layer disposed above the first active region, a second active region disposed above the second insulating layer, a charge storage layer structure disposed at least next to at least one sidewall of the fin structure covering at least a portion of the first active region and at least a portion of the second active region, and a control gate disposed next to the charge storage layer structure.

Abstract: Embodiments of the present invention relate generally to integrated circuits, methods for manufacturing an integrated circuit, memory modules, and computing systems.

Abstract: An electronic circuit arrangement includes at least one memory element in which at least two electrical quantities can be stored. A switching unit is electrically connected to the memory element and has at least one first circuit path and a second circuit path. A storage unit has a first partial storage unit and a second partial storage unit. Each partial storage unit is set up for storing at least one electrical quantity. The switching unit is set up in such a way that it can sequentially pass a first one of the at least two electrical quantities along the first circuit path to the first partial storage unit and a second one of the at least two electrical quantities along the second circuit path to the second partial storage unit.

Abstract: In accordance with embodiments of the invention, there are provided integrated circuits, memory controller, a method for determining a level for programming or erasing a memory segment, and a method for determining a wear level score for a memory segment. In an embodiment of the invention, a method for determining a level for programming or erasing a memory segment is provided, wherein a first level for programming or erasing a memory segment is determined as a function of an initial program/erase level. Furthermore, a first updated level is determined for a subsequent program/erase operation of the memory segment and a second level for programming or erasing the memory segment subsequent to programming or erasing the memory segment is determined using the first level, wherein the second level is determined as a function of the first updated level.

Abstract: An electronic circuit arrangement includes a storage unit set up for storing at least two analog electrical quantities. A first evaluation circuit is coupled to the storage unit and is set up in such a way that it assesses the at least two analog electrical quantities and provides a first assessment result. A second evaluation circuit is coupled to the storage unit and is set up in such a way that it assesses at least one of the at least two analog electrical quantities with a predetermined threshold value and provides a second assessment result.

Abstract: A method for forming trenches on a surface of a semiconductor substrate is described. The method may include: etching a first plurality of trenches into the surface of the semiconductor substrate; filling the first plurality of trenches with at least one material; and etching a second plurality of trenches into every second trench of the first plurality of trenches. Furthermore, a method for forming floating-gate electrodes on a semiconductor substrate and an integrated circuit is described.

Abstract: An integrated circuit is described. The integrated circuit may comprise a multitude of floating-gate electrodes, wherein at least one of the floating-gate electrodes has a lower width and an upper width, the lower width being larger than the upper width, and wherein the at least one of the floating-gate electrodes comprises a transition metal. A corresponding manufacturing method for an integrated circuit is also described.

Abstract: In an embodiment of the invention, a method of operating an integrated circuit for reading the logical state of a selected one of a plurality of memory cells included within a memory cell string in the integrated circuit is provided.

Abstract: A method for leveling bit errors in a charge-trapping memory device is included. The memory device has a first and a second sector of memory cells. The first sector is validated by counting a number of bit failures occurring in memory cells of the first sector, the bit failures caused by accessing memory cells of the second sector. Data stored in the first sector is backed up if the validating indicates a likelihood of a forthcoming failure in the first sector.

Abstract: An integrated circuit and a method for transferring data is provided. One embodiment provides a method for transferring data in an integrated circuit. The method includes driving a first line in accordance with data to be transferred. The data is transmitted from the first line to a second line based on a capacitive coupling.

Abstract: A method of reading memory includes sensing a plurality of memory cells simultaneously and providing a data signal corresponding to one of a plurality of programming states. The plurality of programming states include a number of programming states equal to twice a number of memory cells in the plurality of memory cells. The data signal is processed, providing binary data representative of the data signal. The binary data includes a number of information bits equal to the number of memory cells.

Abstract: An integrated circuit including a first gate stack and a second gate stack and a method of manufacturing is disclosed. One embodiment provides non-volatile memory cells including a first gate stack and a gate dielectric on a first surface section of a main surface of a semiconductor substrate, and a second gate stack including a memory layer stack on a second surface section. A first pattern is transferred into the first gate stack and a second pattern into the second gate stack.

Abstract: A memory device is provided including memory cells that are capable of switching between at least two states, where the threshold of a sense signal for detecting the current state depends on a data content of the memory cell. Parallel to a user data block, a primary control word including a predetermined number of bits of a first state is stored in a check section of the cell array. The check section is read by applying sense signals of different amplitudes, where in each case a secondary control word is obtained. By checking in each secondary control word the number of bits of the first state, the margins of the current sense signal amplitude towards the sense window limits may be checked and the sense signal amplitude may be adapted permanently to a sense window drift, so as to enhance the reliability of the memory device.

Abstract: A memory device comprises a plurality of first and second non-volatile memory cells arranged as an array. Each memory cell stores information. The memory device further comprises an access unit coupled to the array. The access unit stores information in the plurality of first and second non-volatile memory cells. The memory device further comprises a verifying unit coupled to the array. The verifying unit verifies the information stored in a group of the first and second memory cells by verifying only a subset of the group. The subset comprises at least one of the second memory cells.

Abstract: A memory device including a cell array is disclosed. One embodiment includes a plurality of memory cells, wherein each memory cell is capable of showing at least two distinguishable states, a programmable read voltage source adapted to supply an alterable read voltage and a test control unit. The test control unit includes a voltage control unit that is capable of controlling the read voltage source, a counter unit that is capable of counting the memory cells exhibiting a predetermined state and an analysis unit that is capable of rating a currently determined number of memory cells exhibiting a predetermined state.

Abstract: A memory device is provided including memory cells that are capable of switching between at least two states, where the threshold of a sense signal for detecting the current state depends on a data content of the memory cell. Parallel to a user data block, a primary control word including a predetermined number of bits of a first state is stored in a check section of the cell array. The check section is read by applying sense signals of different amplitudes, where in each case a secondary control word is obtained. By checking in each secondary control word the number of bits of the first state, the margins of the current sense signal amplitude towards the sense window limits may be checked and the sense signal amplitude may be adapted permanently to a sense window drift, so as to enhance the reliability of the memory device.

Abstract: A charge-trapping memory device includes an array of non-volatile memory cells. The array has at least a first sector and a second sector. Each sector includes a multiplicity of memory cells. Each memory cell is adapted to trap an amount of charge indicative of a programming state. A control circuit is operationally connected to the array and is adapted to access a memory cell of the array by means of storing charge in or removing charge from the memory cell. A disturb detection circuit is operationally connected to the array or the control circuit and is adapted to detect a disturbance level of the first sector based on a disturbance caused by accessing at least one memory cell of the second sector. A disturb leveling circuit is operationally connected to the array and the disturb detection circuit and is adapted to backup the programming state of memory cells of the first sector if the detected disturbance level exceeds a predefined threshold.

Abstract: Memory cell transistors with back-channel isolation are produced without using an SOI substrate. With the word line stack acting as a mask, the semiconductor material is etched on both sides of the world line, first anisotropically and then isotropically to widen the etch hole and form an undercut beneath the gate electrode and at a distance from the ONO storage layer forming the gate dielectric. The undercut is filled, whereby a buried oxide layer of at least 20 nm maximum thickness is formed underneath the channel region. The latter is p-doped at a density of at least 1017 cm?3.