Abstract: A silicon-based quantum device is provided. The device comprises: a first metallic structure (501); a second metallic structure (502) laterally separated from the first metallic structure; and an L-shaped elongate channel (520) defined by the separation between the first and second metallic structures; wherein the elongate channel has a vertex (505) connecting two elongate parts of the elongate channel. The device further comprises: a third metallic structure (518), mediator gate, positioned in the elongate channel; a fourth metallic structure (531) forming a first barrier gate, arranged at a first end of the third metallic structure; and a fifth metallic structure (532) forming a second barrier gate arranged at a second end of the third metallic structure. The first, second, third, fourth and fifth metallic structures are configured for connection to first, second, third, fourth and fifth electric potentials respectively.

Abstract: Processor elements are disclosed herein. A processor element comprises a silicon layer. The processor element further comprises a dielectric layer disposed upon and forming an interface with the silicon layer. The processor element further comprises a conductive via in contact with the dielectric layer, the conductive via comprising a metallic portion having an interface end closest to the dielectric layer and a distal end. A cross-sectional area of the interface end of the metallic portion of the conductive via is less than or equal to 100 nm by 100 nm. In use, the application of a bias potential to the distal end of the conductive via induces a quantum dot at the interface between the dielectric layer and the silicon layer, the quantum dot for confining one or more electrons or holes in the silicon layer. Methods are also described herein.