Patents Assigned to R and D Corporation Limited
  • Dual-emitter lateral magnetometer
    Patent number: 5514899
    Abstract: A magnetometer or magnetic field sensor includes semiconductor material deposited laterally on an insulating substrate. The semiconductor material is alternating regions of n- and p-type silicon provided with two cathodes, an anode and a triggering node. Upon application of a triggering pulse to a switch on the sensor, a carrier domain is formed. In the presence of a magnetic field this carrier domain is deflected to one side thus causing an imbalance in the current collected at the two cathodes.
    Type: Grant
    Filed: May 11, 1994
    Date of Patent: May 7, 1996
    Assignees: Hong Kong University of Science and Technology, R and D Corporation Limited
    Inventors: Jack Lau, Christopher C. T. Nguyen, Ping Ko, Philip C. Chan
  • Pulmonary drug delivery system
    Patent number: 5451569
    Abstract: The present invention provides a method of improving the efficiency of absorption into the bloodstream of drugs delivered through the pulmonary route. The drug is mixed with surfactant, preferably a surfactant naturally produced by the lung. This method is found to enhance the absorption of pharmaceutical compositions, and in particular those comprising protein, eg insulin, or peptides, eg vasopressin.
    Type: Grant
    Filed: April 19, 1994
    Date of Patent: September 19, 1995
    Assignee: Hong Kong University of Science and Technology R & D Corporation Limited
    Inventors: Jeffrey T.-F. Wong, Michael S.-C. Tam
  • Method for the deposition of diamond on a substrate
    Patent number: 5368681
    Abstract: A method is disclosed for the deposition of crystalline diamond on a substrate such as a silicon wafer. A polymer (for example poly(methylmethacrylate)) is provided as a target for laser ablation using for example an ArF excimer laser or an Nd-Yag laser. The laser ablation is performed in the presence of a reactive gas such as oxygen or hydrogen. The substrate is heated to a temperature of between 450 and 700 degrees celsius.
    Type: Grant
    Filed: June 9, 1993
    Date of Patent: November 29, 1994
    Assignees: Hong Kong University of Science, Hong Kong University of Science and Technology, R and D Corporation Limited
    Inventors: Hiroyuki Hiraoka, Stefan A. Latsch, Rong-Fu Xiao