Abstract: A first semiconductor die may comprise an interface circuit and a demodulation circuit. The interface circuit may be operable to receive an externally generated signal and recover decisions of a symbol de-mapper carried in the externally generated signal. The demodulation circuit may be operable to recover one or more transport streams based on the decisions of the symbol de-mapper. The first semiconductor die may comprise circuitry operable to combine a plurality of signals from a plurality of second semiconductor dice, where each of the plurality of signals comprises decisions of a respective one of a plurality of symbol de-mappers.