Abstract: A method of manufacturing a diaphragm utilizing a precision grinding technique after etching a cavity in a wafer. A technique for preventing distortion of the diaphragm based on use of a sacrificial layer of porous silicon is disclosed.
Type:
Application
Filed:
June 18, 2001
Publication date:
April 18, 2002
Applicant:
RANDOX LABORATORIES LIMITED
Inventors:
Harold S. Gamble, S.J. Neil Mitchell, Andrzej Prochaska, Stephen Peter Fitzgerald
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