Patents Assigned to RAPT Industries, Inc.
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Patent number: 7955513Abstract: A method for shaping a surface of a workpiece, comprises positioning at least one of a workpiece and an inductively-coupled plasma (ICP) torch including three concentrically arranged tubes. A plasma gas is introduced to an outer tube of the ICP torch and energy is transferred from a radio frequency (RF) power source to the plasma gas to generate an excitation zone at least partially downstream of the ICP torch. A reactive reactive precursor is introduced to the excitation zone, and an auxiliary gas is introduced to the intermediate tube to control a position of the excitation zone relative to the ICP torch so that a controlled distribution of reactive species is formed. The surface is shaped by removing material from the surface of the workpiece with at least a portion of the reactive species and adding material to the surface of the workpiece with at least a portion of the reactive species.Type: GrantFiled: December 20, 2007Date of Patent: June 7, 2011Assignee: Rapt Industries, Inc.Inventor: Jeffrey W. Carr
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Patent number: 7591957Abstract: Reactive atom plasma processing can be used to shape, polish, planarize and clean the surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, and/or clean the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from the surface of the workpiece.Type: GrantFiled: November 1, 2001Date of Patent: September 22, 2009Assignee: RAPT Industries, Inc.Inventor: Jeffrey W. Carr
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Patent number: 7510664Abstract: Fabrication apparatus and methods are disclosed for shaping and finishing difficult materials with no subsurface damage. The apparatus and methods use an atmospheric pressure mixed gas plasma discharge as a sub-aperture polisher of, for example, fused silica and single crystal silicon, silicon carbide and other materials. In one example, workpiece material is removed at the atomic level through reaction with fluorine atoms. In this example, these reactive species are produced by a noble gas plasma from trace constituent fluorocarbons or other fluorine containing gases added to the host argon matrix. The products of the reaction are gas phase compounds that flow from the surface of the workpiece, exposing fresh material to the etchant without condensation and redeposition on the newly created surface. The discharge provides a stable and predictable distribution of reactive species permitting the generation of a predetermined surface by translating the plasma across the workpiece along a calculated path.Type: GrantFiled: November 1, 2001Date of Patent: March 31, 2009Assignee: RAPT Industries, Inc.Inventor: Jeffrey W. Carr
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Patent number: 7371992Abstract: A flame torch can be used to clean the surface of a contact-sensitive object, such as a glass optic, extremely thin workpiece, or semiconductor wafer by providing a reactive precursor gas to the feed gases of the torch. Reactive atom plasma processing can be used to clean the surface of a contaminant that chemically combines with the atomic radicals of the precursor without affecting the surface. The torch can also be used to modify the surface after cleaning, without transferring the object or engaging in any intermediate processing, by supplying a second reactive precursor that reacts with the surface itself. The flame torch can be used to shape, polish, etch, planarize, deposit, chemically modify and/or redistribute material on the surface of the object. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.Type: GrantFiled: March 7, 2003Date of Patent: May 13, 2008Assignee: RAPT Industries, Inc.Inventor: Jeffrey W. Carr
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Publication number: 20080099441Abstract: A method for shaping a surface of a workpiece, comprises positioning at least one of a workpiece and an inductively-coupled plasma (ICP) torch including three concentrically arranged tubes. A plasma gas is introduced to an outer tube of the ICP torch and energy is transferred from a radio frequency (RF) power source to the plasma gas to generate an excitation zone at least partially downstream of the ICP torch. A reactive reactive precursor is introduced to the excitation zone, and an auxiliary gas is introduced to the intermediate tube to control a position of the excitation zone relative to the ICP torch so that a controlled distribution of reactive species is formed. The surface is shaped by removing material from the surface of the workpiece with at least a portion of the reactive species and adding material to the surface of the workpiece with at least a portion of the reactive species.Type: ApplicationFiled: December 20, 2007Publication date: May 1, 2008Applicant: RAPT INDUSTRIES, INC.Inventor: Jeffrey Carr
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Publication number: 20080083425Abstract: A flame torch can be used to clean the surface of a contact-sensitive object, such as a glass optic, extremely thin workpiece, or semiconductor wafer by providing a reactive precursor gas to the feed gases of the torch. Reactive atom plasma processing can be used to clean the surface of a contaminant that chemically combines with the atomic radicals of the precursor without affecting the surface. The torch can also be used to modify the surface after cleaning, without transferring the object or engaging in any intermediate processing, by supplying a second reactive precursor that reacts with the surface itself. The flame torch can be used to shape, polish, etch, planarize, deposit, chemically modify and/or redistribute material on the surface of the object. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.Type: ApplicationFiled: October 11, 2007Publication date: April 10, 2008Applicant: RAPT INDUSTRIES, INC.Inventor: Jeffrey Carr
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Publication number: 20080035612Abstract: A method for reducing heat applied to a workpiece by a plasma discharge of a reactive plasma torch comprises determining a footprint of the plasma discharge on a surface of the workpiece based on a distance of the reactive atom plasma torch from the surface, determining a maximum heat absorbable by the workpiece, and determining an adjusted footprint of the reactive atom plasma torch on the surface based on the maximum heat absorbable by the workpiece. An aperture of an aperture device is selected based on the adjusted footprint of the reactive atom plasma torch. The aperture device is then positioned so that a portion of the plasma is one or both of deflected and absorbed by the aperture device, thereby reducing the heat absorbed by the workpiece.Type: ApplicationFiled: October 19, 2007Publication date: February 14, 2008Applicant: RAPT INDUSTRIES, INC.Inventors: Andrew Chang, Jeffrey Carr, Jude Kelley, Peter Fiske
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Publication number: 20080029485Abstract: A tool for modifying a surface of a workpiece comprises a heat source having a modifiable footprint for heating a selectable portion of the surface, a reactive atom plasma torch, and a reactive precursor receivable within a plasma of the reactive atom plasma torch. The reactive cursor is received by the plasma to form a reactive species that chemically combines with a portion of the surface heated by the footprint of the heat source to produce a gas and leave the surface.Type: ApplicationFiled: October 15, 2007Publication date: February 7, 2008Applicant: RAPT INDUSTRIES, INC.Inventors: Jude Kelley, Jeffrey Carr, Peter Fiske
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Patent number: 7311851Abstract: Reactive atom plasma processing can be used to shape, polish, planarize, and clean surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, clean and/or deposit material on the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from, and/or redistributing material on, the surface of the workpiece. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.Type: GrantFiled: June 27, 2003Date of Patent: December 25, 2007Assignee: Rapt Industries, Inc.Inventor: Jeffrey W. Carr
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Patent number: 7304263Abstract: The footprint of a reactive atom plasma processing tool can be modified using an aperture device. A flow of reactive gas can be injected into the center of an annular plasma. An aperture can be positioned relative to the plasma such that the effective footprint of the plasma can be changed without adjusting the gas flows or swapping out the tool. Once the aperture and tool are in position relative to a workpiece, reactive atom plasma processing can be used to modify the surface of the workpiece, such as to etch, smooth, polish, clean, and/or deposit material onto the workpiece. If necessary, a coolant can be circulated about the aperture. Multiple apertures can also be used to provide a variety of footprint sizes and/or shapes. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.Type: GrantFiled: August 5, 2004Date of Patent: December 4, 2007Assignee: RAPT Industries, Inc.Inventors: Andrew Chang, Jeffrey W. Carr, Jude Kelley, Peter S. Fiske
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Patent number: 7297892Abstract: A controllable heat source, such as a laser or flame torch, can be used to pre-heat a portion of the surface of a workpiece, such as a glass optic or semiconductor wafer. Reactive atom plasma (RAP) processing can be used to modify the pre-heated surface portion, as the pre-heated material will more readily chemically combine with the atomic radicals of the precursor in the plasma. A RAP torch, such as an ICP plasma torch, MIP plasma torch, or flame torch, can be used to shape, polish, etch, planarize, deposit, chemically modify and/or redistribute material on the surface of the workpiece. The material modified by the torch can substantially correspond to the pattern or portion of the surface that was pre-heated by the heat source. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.Type: GrantFiled: August 6, 2004Date of Patent: November 20, 2007Assignee: RAPT Industries, Inc.Inventors: Jude Kelley, Jeffrey W. Carr, Peter S. Fiske
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Publication number: 20050184034Abstract: Reactive atom plasma processing (RAP) can be used to shape, polish, planarize, and clean surfaces of difficult materials with minimal subsurface damage. An improved RAP device utilizes a microwave-induced plasma (MIP) source instead of a conventional ICP torch to modify these surfaces. The use of MIP provides for a smaller footprint, finer detail, simpler and enhanced movement capabilities, lower heat load, fewer shielding requirements, and cheaper construction and operation than ICP. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.Type: ApplicationFiled: March 25, 2005Publication date: August 25, 2005Applicant: Rapt Industries, Inc.Inventor: Jeffrey Carr
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Publication number: 20050061774Abstract: High-quality glass parts, such as high-end optics, can be generated using a completely damage free process. An intial damage-free forming step, such as sluping, can be used to roughly shape a glass workpiece without imparting any subsurface damage. A reactive atom processing (RAP) process can then be used to rapidly remove any anomalies or imperfections from the surface of the optic without imparting any damage unto the optic. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.Type: ApplicationFiled: August 6, 2004Publication date: March 24, 2005Applicant: RAPT Industries, Inc.Inventors: Jude Kelley, Jeffrey Carr, Peter Fiske, Andrew Chang
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Publication number: 20050061783Abstract: A controllable heat source, such as a laser or flame torch, can be used to pre-heat a portion of the surface of a workpiece, such as a glass optic or semiconductor wafer. Reactive atom plasma (RAP) processing can be used to modify the pre-heated surface portion, as the pre-heated material will more readily chemically combine with the atomic radicals of the precursor in the plasma. A RAP torch, such as an ICP plasma torch, MIP plasma torch, or flame torch, can be used to shape, polish, etch, planarize, deposit, chemically modify and/or redistribute material on the surface of the workpiece. The material modified by the torch can substantially correspond to the pattern or portion of the surface that was pre-heated by the heat source. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.Type: ApplicationFiled: August 6, 2004Publication date: March 24, 2005Applicant: RAPT Industries, Inc.Inventors: Jude Kelley, Jeffrey Carr, Peter Fiske
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Publication number: 20050061782Abstract: The footprint of a reactive atom plasma processing tool can be modified using an aperture device. A flow of reactive gas can be injected into the center of an annular plasma. An aperture can be positioned relative to the plasma such that the effective footprint of the plasma can be changed without adjusting the gas flows or swapping out the tool. Once the aperture and tool are in position relative to a workpiece, reactive atom plasma processing can be used to modify the surface of the workpiece, such as to etch, smooth, polish, clean, and/or deposit material onto the workpiece. If necessary, a coolant can be circulated about the aperture. Multiple apertures can also be used to provide a variety of footprint sizes and/or shapes. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.Type: ApplicationFiled: August 5, 2004Publication date: March 24, 2005Applicant: Rapt Industries, Inc.Inventors: Andrew Chang, Jeffrey Carr, Jude Kelley, Peter Fiske
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Publication number: 20050000656Abstract: Reactive atom plasma processing can be used to shape, polish, planarize and clean the surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, and/or clean the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from the surface of the workpiece.Type: ApplicationFiled: June 15, 2004Publication date: January 6, 2005Applicant: RAPT Industries, Inc.Inventor: Jeffrey Carr
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Publication number: 20040200802Abstract: Reactive atom plasma processing can be used to shape, polish, planarize, and clean surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, clean and/or deposit material on the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from, and/or redistributing material on, the surface of the workpiece.Type: ApplicationFiled: June 27, 2003Publication date: October 14, 2004Applicant: RAPT. INDUSTRIES INC.Inventor: Jeffrey W. Carr
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Patent number: 6660177Abstract: Reactive atom plasma processing can be used to shape, polish, planarize, and clean surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, clean and/or deposit material on the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from, and/or redistributing material on, the surface of the workpiece.Type: GrantFiled: November 7, 2001Date of Patent: December 9, 2003Assignee: Rapt Industries Inc.Inventor: Jeffrey W. Carr