Abstract: An integrated testing and handler mechanism includes an input/output module including: an input section, an output section, a turret that includes a plurality of pickup heads, and a shuttle configured to move the carrier from the component loading location to a test module transfer location; and a test module including: a test head comprising an array of a plurality of test sockets, a plunger configured to plunge the components held by the carrier into the test sockets when the carrier is located on the plunger, and a rotary table that includes a plurality of grippers that rotate around the rotary table, the rotary table being configured to (i) transfer a carrier between the test module transfer location and an input/output module transfer location, (ii) rotate the carrier between the input/output module transfer location and a plunger transfer location, and (iii) transfer the carrier between the plunger transfer location and plunger.

Abstract: According to the present invention there is provided a method of handling devices comprising the steps of, receiving a tray on which devices to be tested are supported, into a flipping station; positioning the tray under a boat, so that the devices which are supported on the tray are sandwiched between the tray and a surface of the boat which can support devices, to form a first stack; flipping the first stack, so that the tray is positioned over the boat, to cause the devices to fall, under the influence of gravity, away from the tray to become supported on the surface of the boat, thereby transferring the devices from the tray to the surface of the boat; moving the boat to a testing station and testing the devices on the boat; receiving the boat of tested devices into the flipping station; positioning a tray over the boat, so that the devices which are supported on the surface of the boat are sandwiched between the surface of the boat and tray to form a second stack; flipping the second stack so that the bo

Abstract: According to the invention, there is provided a boat which comprises, a surface on which a plurality of electronic components can be supported, the surface having a plurality holes defined therein through which a vacuum can be passed to hold components on the surface; and a first vacuum inlet which is in fluid communication with the plurality of holes, wherein the first vacuum inlet can be fluidly connected to a first vacuum generating means so that the first vacuum generating means can provide a vacuum at the plurality of holes; a second vacuum inlet which is in fluid communication with the same plurality of holes with which the first vacuum inlet is in fluid communication with, wherein the second vacuum inlet can be fluidly connected to a second vacuum generating means so that the second vacuum generating means can provide a vacuum at the plurality of holes.

Abstract: An integrated testing and handler mechanism includes an input/output module including: an input section, an output section, a turret that includes a plurality of pickup heads, and a shuttle configured to move the carrier from the component loading location to a test module transfer location; and a test module including: a test head comprising an array of a plurality of test sockets, a plunger configured to plunge the components held by the carrier into the test sockets when the carrier is located on the plunger, and a rotary table that includes a plurality of grippers that rotate around the rotary table, the rotary table being configured to (i) transfer a carrier between the test module transfer location and an input/output module transfer location, (ii) rotate the carrier between the input/output module transfer location and a plunger transfer location, and (iii) transfer the carrier between the plunger transfer location and plunger.

Abstract: According to the present invention there is provided a method of handling devices comprising the steps of, receiving a tray on which devices to be tested are supported, into a flipping station; positioning the tray under a boat, so that the devices which are supported on the tray are sandwiched between the tray and a surface of the boat which can support devices, to form a first stack; flipping the first stack, so that the tray is positioned over the boat, to cause the devices to fall, under the influence of gravity, away from the tray to become supported on the surface of the boat, thereby transferring the devices from the tray to the surface of the boat; moving the boat to a testing station and testing the devices on the boat; receiving the boat of tested devices into the flipping station; positioning a tray over the boat, so that the devices which are supported on the surface of the boat are sandwiched between the surface of the boat and tray to form a second stack; flipping the second stack so that the bo

Abstract: A chip tray, comprising: a first plate configured to allow a plurality of semiconductor elements to be placed thereon, a positioning and clamping mechanism for pressing and holding the semiconductor elements in predetermined locations on the first plate, and actuator means for actuating the positioning and clamping mechanism comprising movable parts of the positioning and clamping mechanism which can be actuated simultaneously to perform a pressing and holding operation and a releasing operation by the positioning and clamping mechanism simultaneously for all the semiconductor elements, wherein the positioning and clamping mechanism comprises a second plate which is laterally shiftable and lockable with respect to the first plate and comprises a plurality of openings and of elastic members each corresponding to an opening and each provided with a pressure piece adapted for abutting against at least one edge of one of the semiconductor elements, characterized in that wherein the elastic members are self-guidin

Abstract: Contactor arrangement of an IC test handler, comprising: a contactor unit which has test contacts for contacting an IC in test and for temporarily pressing the IC against the test contacts, a plunger head, which has a recessed central region corresponding to the geometrical configuration of the IC, such that those surface of the IC which is adjacent to the upper surface of the plunger head does not touch the plunger head surface, and a contactor unit interface, which includes a vacuum suction system for actively attracting the IC to an IC contact surface of the contactor unit interface, that corresponds with an adjacent surface of the IC having IC device contacts and, thus, towards the test contacts of the contactor unit.

Abstract: According to the present invention there is provided a method for testing electrical and optical parameters of a group of light-emitting devices, the method comprising the steps of, bringing the group of devices to a test position wherein light emitted by the devices in the group can be received into an integrating sphere; performing, electrical testing of the devices in the group in parallel, so that electrical parameters of each of the devices in the group can be determined; performing, in a sequential device-by-device manner, optical testing of the devices in the group, so that optical parameters of each of the devices in the group can be determined. There is further provided a corresponding assembly.

Abstract: An integrated testing and handler mechanism includes an input/output module including: an input section, an output section, a turret that includes a plurality of pickup heads, and a shuttle configured to move the carrier from the component loading location to a test module transfer location; and a test module including: a test head comprising an array of a plurality of test sockets, a plunger configured to plunge the components held by the carrier into the test sockets when the carrier is located on the plunger, and a rotary table that includes a plurality of grippers that rotate around the rotary table, the rotary table being configured to (i) transfer a carrier between the test module transfer location and an input/output module transfer location, (ii) rotate the carrier between the input/output module transfer location and a plunger transfer location, and (iii) transfer the carrier between the plunger transfer location and plunger.

Abstract: The invention provides a microelectromechanical system testing device, comprising an acoustic chamber having two opposing walls; a sound source for generating sound within the acoustic chamber at a first frequency in the range of 20 Hz to 10 kHz, the sound source being arranged at one of the opposing walls; and an interface for coupling one or more microelectromechanical systems thereto, the interface being arranged at the other of the two opposing walls and comprising a respective coupling site for each microelectromechanical system; wherein the acoustic chamber is adapted to have a total harmonic distortion (THD) at each coupling site of the interface for the first frequency below 1%, preferably below 0.8%, more preferably below 0.6%, most preferably below 0.4% when including all harmonics of the first frequency in the range of 20 Hz to 20 kHz, in particular for the first frequency being 1 kHz or 4 kHz.

Abstract: The invention provides a microelectromechanical system testing device, comprising an acoustic chamber having two opposing walls; a sound source for generating sound within the acoustic chamber at a first frequency in the range of 20 Hz to 10 kHz, the sound source being arranged at one of the opposing walls; and an interface for coupling one or more microelectromechanical systems thereto, the interface being arranged at the other of the two opposing walls and comprising a respective coupling site for each microelectromechanical system; wherein the acoustic chamber is adapted to have a total harmonic distortion (THD) at each coupling site of the interface for the first frequency below 1%, preferably below 0.8%, more preferably below 0.6%, most preferably below 0.4% when including all harmonics of the first frequency in the range of 20 Hz to 20 kHz, in particular for the first frequency being 1 kHz or 4 kHz.

Abstract: The present invention relates to a guide device comprising a baseplate unit having formed therein a guide channel for guiding electronic devices, wherein at least two portions of the baseplate unit are spatially fixed, said guide device being characterized in that means for compensating the thermal expansion of the baseplate unit are provided. The invention additionally relates to a test apparatus which comprises the guide device according to the present invention.

Abstract: The invention relates to a device for testing electronic components (3) with at least two mechanical transfer elements (5a, 5b), of which each can be loaded in each case at a dedicated loading position with an electronic component (3) and with a common test position (7), into which the two transfer elements (5a, 5b) can be brought. Furthermore, the invention relates to a device for testing electronic components with at least two mechanical transfer elements (80a, 80b), of which each can be loaded in each case at a common loading position (88) with an electronic component (3) and with a common test position (89), into which the two transfer elements (80a, 80b) can be brought. The invention also relates to the associated method.

Abstract: The present invention relates to a guide device comprising a baseplate unit having formed therein a guide channel for guiding electronic devices, wherein at least two portions of the baseplate unit are spatially fixed, said guide device being characterized in that means for compensating the thermal expansion of the baseplate unit are provided. The invention additionally relates to a test apparatus which comprises the guide device according to the present invention.

Abstract: The invention relates to a device for testing electronic components (3) with at least two mechanical transfer elements (5a, 5b), of which each can be loaded in each case at a dedicated loading position with an electronic component (3) and with a common test position (7), into which the two transfer elements (5a, 5b) can be brought. Furthermore, the invention relates to a device for testing electronic components with at least two mechanical transfer elements (80a, 80b), of which each can be loaded in each case at a common loading position (88) with an electronic component (3) and with a common test position (89), into which the two transfer elements (80a, 80b) can be brought. The invention also relates to the associated method.