Patents Assigned to Raytheon Comapny
  • Patent number: 7562908
    Abstract: A flexible fluid conduit joint includes two or more flexible sections that preferentially bend about respective preferential bend axes of the sections. The sections each include a flexible bellows coupled at longitudinal ends to a pair of annular collars, and a pair of blade flexures or plates that are also attached to the annular collars. The blade flexures or plates prevent longitudinal expansion of the bellows, and inhibit bending of the flexible sections about an axis that is perpendicular to the plane or planes that the flexures define. Flexing of each section is thus preferentially channeled into a preferentially bending axis within or parallel to the plane or planes defined by the flexures. The sections have different orientations for their blade flexures or plates, allowing the flexible joint to act as a two-axis pivot that does not expand under fluid pressure.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: July 21, 2009
    Assignee: Raytheon Comapny
    Inventor: Dominic S. Nuccitelli
  • Patent number: 5827775
    Abstract: Phase mask laser machining procedures for fabricating high density fine pattern feature electrical interconnection structures. Conductor patterns are fabricated using a phase mask laser patterned dielectric layer as a conductor wet etch masking layer, or by subtractively removing metal using holographic phase mask laser micromachining. In accordance with the present invention, a substrate is provided, a first layer of dielectric material is formed on the substrate, a metal layer is formed on the first layer of dielectric material, and a second layer of dielectric material is then formed on the metal layer. A phase mask is disposed above the second layer of dielectric material that has a predefined phase pattern therein defining a metal conductor pattern that corresponds to an interconnect structure. The second layer of dielectric material is then processed using the phase mask to form the interconnect structure.
    Type: Grant
    Filed: November 12, 1997
    Date of Patent: October 27, 1998
    Assignee: Raytheon Comapny
    Inventors: Robert S. Miles, Philip A. Trask, Vincent A. Pillai