Abstract: The present invention relates in general terms to the treatment or processing of substrate surfaces. In particular, the invention relates to processes for modifying the surface of silicon wafers.

Abstract: A surface treatment of electrical contact pieces in electrolytic plants, in particular of machines for the treatment of circuit boards and conductor sheets is discloses, wherein the contact pieces are made of titanium or some other oxidizing and therefore chemically and electrochemically resistant material. To eliminate unwanted metallization of the contact pieces as a result of an inadequate demetallization on account of the insulating oxide layer and in order to enhance protection against wear, an electrically conductive diamond coating is applied at least on the contact-making areas of the contact pieces.

Abstract: The present invention is directed to a device for retaining substrates (S), such as wafers or silicon substrates for the production of photovoltaic elements. The device includes opposing walls (1) that are interconnected by at least two rod-like carrier elements (2, 3) that are provided with a retaining means (5) for retaining the substrates (S) in a vertical position oriented parallel to the walls (1). At least one rod-like counter carrier element (4) is also provided and interconnects the two walls (1). The counter carrier element (4) is positioned in relation to the carrier elements (2, 3) so that vertical movement of the substrates (S) relative to the walls (1) is limited and loading or unloading of the substrates (S) is possible at a slant in relation to the vertical direction (V).

Abstract: An apparatus for cleaning wafers using the CMP process includes a transport device of a feeding station at the beginning of a cleaning line which has a plurality of transport rollers disposed and driven transversely to the direction of transport. The cleaning line transports polished wafers to a main cleaning station having several pairs of transport rollers for transporting the wafers through the main cleaning station and several pairs of cleaning rollers for cleaning the wafers, wherein a supply of a cleaning medium to the pairs of cleaning rollers is provided in the main cleaning station. A withdrawal station is disposed at the end of the cleaning line in which a robot takes up a wafer and transports it to a drying station, wherein the withdrawal station has a first detector.

Abstract: The invention relates to transporting rollers (22) for transporting essentially flat articles, to holding-down means (23) for pressing the articles onto transporting rollers (22), and to a transporting system (30). In this case, the transporting roller (22) is of at least two-part configuration and comprises a spindle element and at least one track element (1), the latter enclosing the spindle element in a tubular manner.

Abstract: The invention relates to transporting rollers (22) for transporting essentially flat articles, to holding-down means (23) for pressing the articles onto transporting rollers (22), and to a transporting system (30). In this case, the transporting roller (22) is of at least two-part configuration and comprises a spindle element and at least one track element (1), the latter enclosing the spindle element in a tubular manner.