Patents Assigned to Reseach Triangle Institute
  • Publication number: 20120045752
    Abstract: A bioparticle collection device and an aerosol collection system. The bioparticle collection device includes a collection medium including a plurality of fibers formed into a fiber mat and configured to collect bioparticles thereon, and includes a viability enhancing material provider disposed in a vicinity of the plurality of fibers and configured to provide a viability enhancing material to the collected bioparticles to maintain viability of the bioparticles collected by the fiber mat. The aerosol collection system includes an aerosol pumping device configured to entrain particles in an gas stream, an aerosol saturation device configured to saturate the particles in the gas stream with a biocompatible liquid, and an aerosol collection medium downstream from the aerosol saturation device and including a plurality of fibers formed into a fiber mat for collection of the saturated aerosol particles.
    Type: Application
    Filed: August 17, 2011
    Publication date: February 23, 2012
    Applicant: Reseach Triangle Institute
    Inventors: David S. ENSOR, Howard J. Walls, Karin K. Foarde
  • Publication number: 20090057879
    Abstract: A structure and method for thermal management of integrated circuits. The structure for thermal management of integrated circuits includes first and second substrates bonded together, at least one of the first and second substrates including at least one circuit element, an entrance through-hole having a length extending through a thickness of at least one of the first substrate and the second substrate, an exit through-hole having a length extending through a thickness of at least one of the first substrate and the second substrate, a bonding element forming a seal between the first and second substrates and forming a space between the first and second substrate, and a coolant channel formed in the space between the first and second substrates such that a fluid entering the entrance through-hole transits the coolant channel and the exit through-hole to provide cooling to the circuit element.
    Type: Application
    Filed: August 28, 2007
    Publication date: March 5, 2009
    Applicant: Reseach Triangle Institute
    Inventors: Philip GARROU, Charles Kenneth WILLIAMS, Christopher A. BOWER