Abstract: Methods of facilitating commercial production of supported conductive networks without the use of hazardous chemicals including using heat flowable adhesive in the formation of the networks, providing contact pads exposed through a dielectric substrate which supports a conductive network, using the thickness of a conductor supporting dielectric layer to space the conductors and providing conductor and waste material cross-sections trapezoidal in shape in a non-planar pattern during manufacture of the networks.

Abstract: Methods of facilitating commercial production of supported conductive networks without the use of hazardous chemicals including using heat flowable adhesive in the formation of the networks, providing contact pads exposed through a dielectric substrate which supports a conductive network, using the thickness of a conductor supporting dielectric layer to space the conductors and providing conductor and waste material cross-sections trapezoidal in shape in a non-planar pattern during manufacture of the networks.

Abstract: A process and apparatus for producing supported conductive networks which can be flexible or rigid, having densely packed circuits. The process and apparatus for making the conductive network involves forming a conductive material supported on a "dynamic pressure cushion" into a non-planar pattern defining the desired conductive circuits in relation to a fixed reference plane. The "dynamic pressure cushion" is a material having suitable viscosity and flow characteristics to flow out from under the conductive material as it is being formed and fill up any voids. To ensure that the "dynamic pressure cushion" properly flows without deforming the desired circuits, the die used to form the conductive material is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane leaving the desired conductive circuits.

Abstract: A process and apparatus for producing supported conductive networks which can be flexible or rigid, having densely packed circuits. The process and apparatus for making the conductive network involves forming a conductive material supported on a "dynamic pressure cushion" into a non-planar pattern defining the desired conductive circuits in relation to a fixed reference plane. The "dynamic pressure cushion" is a material having suitable viscosity and flow characteristics to flow out from under the conductive material as it is being formed and fill up any voids. To ensure that the "dynamic pressure cushion" properly flows without deforming the desired circuits, the die used to form the conductive material is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane leaving the desired conductive circuits.

Abstract: A process and apparatus for producing supported conductive networks which can be flexible or rigid, having densely packed circuits. The process and apparatus for making the conductive network involves forming a conductive material supported on a "dynamic pressure cushion" into a non-planar pattern defining the desired conductive circuits in relation to a fixed reference plane. The "dynamic pressure cushion" is a material having suitable viscosity and flow characteristics to flow out from under the conductive material as it is being formed and fill up any voids. To ensure that the "dynamic pressure cushion" properly flows without deforming the desired circuits, the die used to form the conductive material is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane leaving the desired conductive circuits.

Abstract: A conductive network, which can be flexible or rigid, can have self-aligning conductors which connect with corresponding conductors of other networks. The conductive network can be fabricated into densely packed contact clusters for use as electrical interconnectors or circuits. The contact clusters, which can be configured to substantially any shape, are the essential components of high density connector assemblies. The methods and apparatus for making the conductive network and cluster contacts are also described.

Abstract: A connector for electrically conductive connection to electrically conductive contact pads of a circuit comprising a rigid housing; a flexible circuit housed, at least in part, in said housing and having an end portion carrying a row of conductive circuit areas on one face thereof corresponding to said row of pads; a spring structure having a resilient arched feature and being held captive by the housing while being permitted a limited desired float, the flexible circuit being captively located relative to the housing so that the areas are resiliently urged by the arched feature into electrically conductive contact with the pads when the connector is attached at a desired location to the circuit.