Patents Assigned to Ricoh Microelectronics Co., Ltd.
  • Patent number: 7732935
    Abstract: A wiring board includes a substrate made of an insulation material and wired by a conductive material. A plurality of electrodes is formed on a surface of the substrate. A non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer are formed as the electrodes.
    Type: Grant
    Filed: April 20, 2006
    Date of Patent: June 8, 2010
    Assignees: Ricoh Company, Ltd., Ricoh Microelectronics Co., Ltd.
    Inventor: Eiji Moriyama
  • Patent number: 6586685
    Abstract: A bump electrode is a bump made from a fused metal in a shape of one of a circular cylinder, a cone, a pyramid, a frustum of a cone, and a frustum of a pyramid, formed on a substrate. A printed circuit board has a substrate and a wiring pattern provided thereon. The wiring pattern is made from one of a paste and a fused metal and has a cross-section at right angles with respect to an extending direction of the wiring pattern with such an aspect ratio of a depth thereof to a width thereof that the depth thereof is greater than a depth with an aspect ratio of 1:5 and the width thereof is smaller than a width with an aspect ratio of 1:5.
    Type: Grant
    Filed: March 16, 1999
    Date of Patent: July 1, 2003
    Assignee: Ricoh Microelectronics Co. Ltd.
    Inventor: Makoto Kinoshita
  • Patent number: 6405648
    Abstract: An intaglio printing method for transferring a resin to a print receiving material, using an intaglio printing master having portions depressed in a printing shape below the surface of the printing master, includes the steps of: filling a resin paste comprising a resin in the depressed portions of the printing master, bringing the printing master, with the resin paste being filled in the depressed portions thereof, into close contact with the print receiving material, hardening the resin in the resin paste in the depressed portions of the printing master, and separating the printing master from the print receiving material so as to transfer the hardened resin in the depressed portions of the printing master to the print receiving material. An apparatus for carrying out this intaglio printing method is proposed. By use of the apparatus, for instance, an elastic and durable spacer free from fatigue destruction for a touch panel is can be prepared in a circulation process.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: June 18, 2002
    Assignee: Ricoh Microelectronics Co., Ltd.
    Inventor: Makoto Kinoshita
  • Patent number: 6405647
    Abstract: An intaglio printing method for transferring a resin to a print receiving material, using an intaglio printing master having portions depressed in a printing shape below the surface of the printing master, includes the steps of: filling a resin paste comprising a resin in the depressed portions of the printing master, bringing the printing master, with the resin paste being filled in the depressed portions thereof, into close contact with the print receiving material, hardening the resin in the resin paste in the depressed portions of the printing master, and separating the printing master from the print receiving material so as to transfer the hardened resin in the depressed portions of the printing master to the print receiving material. An apparatus for carrying out this intaglio printing method is proposed. By use of the apparatus, for instance, an elastic and durable spacer free from fatigue destruction for a touch panel is can be prepared in a circulation process.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: June 18, 2002
    Assignee: Ricoh Microelectronics Co., Ltd.
    Inventor: Makoto Kinoshita
  • Publication number: 20010037738
    Abstract: An intaglio printing method for transferring a resin to a print receiving material, using an intaglio printing master having portions depressed in a printing shape below the surface of the printing master, includes the steps of: filling a resin paste comprising a resin in the depressed portions of the printing master, bringing the printing master, with the resin paste being filled in the depressed portions thereof, into close contact with the print receiving material, hardening the resin in the resin paste in the depressed portions of the printing master, and separating the printing master from the print receiving material so as to transfer the hardened resin in the depressed portions of the printing master to the print receiving material. An apparatus for carrying out this intaglio printing method is proposed. By use of the apparatus, for instance, an elastic and durable spacer free from fatigue destruction for a touch panel is can be prepared in a circulation process.
    Type: Application
    Filed: July 13, 2001
    Publication date: November 8, 2001
    Applicant: Ricoh Microelectronics Co., Ltd.
    Inventor: Makoto Kinoshita
  • Patent number: 6272071
    Abstract: A speed measuring apparatus including a transmitter for transmitting an acoustic reference wave toward a moving-target, the acoustic reference wave being generated based on a reference signal with a predetermined frequency. Also included is a receiver for receiving acoustic reflection waves which are generated by the transmitted acoustic reference wave being reflected by the moving-target, for converting the acoustic reflection waves to receiver signals, and for outputting the receiver signals therefrom. Further, a signal attenuating unit for selectively attenuating a signal component with the same frequency as the frequency of the reference signal in the receiver signals which are output from the receiver and outputting signals therefrom and a band pass filter unit for selecting at least one Doppler signal component from the signals output from the signal attenuating unit are included.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: August 7, 2001
    Assignee: Ricoh Microelectronics Co., Ltd.
    Inventors: Takuo Takai, Fumio Ikeuchi
  • Patent number: 6170394
    Abstract: A method of preparing a plastic mask for paste printing with a plastic sheet being provided with an area containing a predetermined pattern including one or more through-holes is carried out by the steps of bringing the plastic mask provided with electroconductive material on at least one surface into close contact with a printing material while applying an electrical ground potential to the electroconductive material and then using the mask for paste printing by spreading and pressing a past to cause it to pass through any of the through-holes forming the predetermined pattern for deposit on the printing material and then removing the mask from the printing material to leave the paste printing pattern.
    Type: Grant
    Filed: April 16, 1999
    Date of Patent: January 9, 2001
    Assignee: Ricoh Microelectronics Co., Ltd.
    Inventor: Makoto Kinoshita
  • Patent number: 6109175
    Abstract: An intaglio printing method and an intaglio printer are proposed, which are suitable for forming a wiring pattern and/or bumps such as bump electrodes on a print receiving material on which printing is to be performed, such as a substrate and a semiconductor package, using a paste or a fused metal. In addition, a method of forming the wiring pattern and the bumps such as bump electrodes on the printing substrate, using the intaglio printing method, a method for forming a wiring pattern, an apparatus for carrying out the method of forming the wiring pattern, the bump electrode and the wiring pattern are proposed.
    Type: Grant
    Filed: February 20, 1998
    Date of Patent: August 29, 2000
    Assignee: Ricoh Microelectronics Co., Ltd.
    Inventor: Makoto Kinoshita
  • Patent number: 6063476
    Abstract: A method of fabricating a plastic mask for paste printing with a plastic sheet being irradiated with an excimer laser beam for forming at least one penetrating opening containing area including at least one through-hole in the plastic sheet is carried out by the steps of bringing a polymer film capable of absorbing at least part of the excimer laser beam into close contact with a back surface of the plastic sheet which is opposite to an excimer laser beam irradiation side thereof which is to be irradiated with the excimer laser beam; forming at least one penetrating opening containing area including at least one through-hole in the plastic sheet by irradiating the excimer laser beam irradiation side thereof with the excimer laser beam; and removing the polymer film from the plastic sheet after the formation of the penetrating opening containing area. By use of a plastic mask fabricated by the above method, a paste printing is also carried out.
    Type: Grant
    Filed: December 11, 1998
    Date of Patent: May 16, 2000
    Assignee: Ricoh Microelectronics Co., Ltd.
    Inventor: Makoto Kinoshita
  • Patent number: 5887520
    Abstract: A method of fabricating a plastic mask for paste printing with a plastic sheet being irradiated with an excimer laser beam for forming at least one penetrating opening container area including at least one through-hole in the plastic sheet is carried out by the steps of bringing a polymer film capable of absorbing at least part of the excimer laser beam into close contact with a back surface of the plastic sheet which is opposite to an excimer laser beam irradiation side thereof which is to be irradiated with the excimer laser beam; forming at least one penetrating opening containing area including at least one through-hole in the plastic sheet by irradiating the excimer laser beam irradiation side thereof with the excimer laser beam; and removing the polymer film from the plastic sheet after the formation of the penetrating opening containing area. By use of a plastic mask fabricated by the above method, a pasta printing is also carried out.
    Type: Grant
    Filed: December 28, 1995
    Date of Patent: March 30, 1999
    Assignee: Ricoh Microelectronics Co., Ltd.
    Inventor: Makoto Kinoshita