Abstract: Radiation-curable resins as well as thermal and electron-beam-curable resins are provided comprising a polymeric backbone having acrylate or vinyl ether substituents and an ionically bonded neutralizing agent such as an aminoacrylate. These resins are hydrophilic and water-dispersible before curing, but resistant to most solvents including water after curing while preserving a hard, strong, adhesive character which makes them suitable for use as coatings and fabrication of three-dimensional structures in a wide variety of applications.

Abstract: A flowable uncured adhesive elastomeric composition suitable for delivery to assembly sites by pumping through supply lines is provided, which has a tensile strength suitable for formation of a strong bond, comprising: (a) an elastomer having a viscosity higher than flowable; (b) a synthetic resin curable by the same cure system as said non-flowable elastomer in an amount sufficient to lower the viscosity of the mixture to a pumpable level; (c) an unsaturated polymeric adduct of a dicarboxylic acid or dicarboxylic acid derivative in an amount sufficient to provide adhesive properties to the mixture; and (d) a curing agent. Preferably the composition also comprises a crosslink-enhancing coagent in an amount sufficient to lower percent elongation and increase adhesive bond strength of the cured elastomer. The compositions are useful for bonding substrates such as other elastomers, metals, plastics, glass, fibers, paper and fabrics.

Abstract: Uncured adhesive elastomeric compositions are provided comprising an unsaturated polymeric dicarboxylic acid or derivative adduct and an elastomer. These compositions are capable of adhesion to a broad, general range of materials and are useful for bonding elastomers to other elastomers, to plastic materials, to metal, fabrics, fibers, paper and miscellaneous substrates. These materials can also be bonded to each other using a film or spreadable liquid comprised of a composition of this invention and curing said film or liquid in contact with said substrates.