Patents Assigned to Ryoden Semiconductor System Eengineering Corporation
  • Packaged semiconductor chip
    Patent number: 5814883
    Abstract: A semiconductor device includes a substrate having a recess; a semiconductor chip disposed in the recess; a plurality of external electrodes disposed on the substrate; a lid covering the recess; and a heat radiator disposed between the semiconductor chip and the substrate for transmitting heat generated by the semiconductor chip to the substrate for radiation.
    Type: Grant
    Filed: May 1, 1996
    Date of Patent: September 29, 1998
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Eengineering Corporation
    Inventors: Akiyoshi Sawai, Kisamitsu Ono, Hideyuki Ichiyama, Katsunori Asai