Patents Assigned to SAE Magentics, (H.K.) Ltd.
  • Patent number: 8582243
    Abstract: A suspension for a HGA comprises a flexure having a suspension tongue arranged for supporting a slider, which comprising a stainless steel layer and a dielectric layer formed thereon. The dielectric layer has a top surface and bottom surface, a plurality of bonding pads are formed on the top surface at a leading portion of the suspension tongue and arranged for connecting with the slider, and at least two separate supporting pieces are formed on the bottom surface and located at a corresponding position with the bonding pads, thereby releasing stress generated on the bonding pads. The invention also discloses a HGA and a disk drive unit with the same. The invention can release the stress generated on the bonding pads of the suspension, reduce the temperature impact to the suspension, and in turn, reduce thermal crown change of the slider, thereby improving the reading and writing performance.
    Type: Grant
    Filed: April 4, 2011
    Date of Patent: November 12, 2013
    Assignee: SAE Magentics (H.K.) Ltd.
    Inventors: Xianwen Feng, Kun Yi, Duanxin Li
  • Patent number: 8426947
    Abstract: In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein. Further, an uppermost substrate and a lowermost substrate have an electromagnetic shielding layer formed using a ferromagnetic body. The electromagnetic shielding layer is formed in a shielding region except the extending zone. The extending zone is set a part which the wiring electrode crosses, in a peripheral edge part of the device region.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: April 23, 2013
    Assignees: Headway Technologies, Inc., SAE Magentics (H.K.) Ltd.
    Inventors: Yoshitaka Sasaki, Hiroyuki Ito, Atsushi Iijima
  • Publication number: 20090199380
    Abstract: A fixture with a shaped molding may hold a first micro-actuator part and a second micro-actuator part in place for coupling while maintaining the structure of the first micro-actuator part. The first micro-actuator part and the second micro-actuator part may be a frame or a strip of piezoelectric material. A vacuum nozzle system embedded in the fixture may hold the first micro-actuator part in place. A mobile vacuum nozzle system may hold the second micro-actuator in place and positions the second micro-actuator part relative to the first micro-actuator part. A camera system may monitor the process. A dispense may apply epoxy between the first and second micro-actuator part. An ultraviolet source may provide ultraviolet radiation for curing.
    Type: Application
    Filed: March 10, 2009
    Publication date: August 13, 2009
    Applicant: SAE MAGENTICS (H.K.) LTD.
    Inventors: Ming Gao YAO, Masashi SHIRAISHI, Yi Ru XIE
  • Patent number: 7535681
    Abstract: A micro-actuator of the invention includes a support base having two actuator side arms and a rotatable bottom plate positioned between the actuator side arms; wherein at least one of the actuator side arms having a back-turned extension in a first end thereof; a pair of connection elements that connects the rotatable bottom plate to the actuator side arms in a second end thereof, respectively; at least one PZT elements bonded to the actuator side arms in its length and the back-turned extension. The rotatable plate rotates in a first direction when the at least one PZT elements expand, and a second direction when the at least one PZT elements contract. The invention also discloses a HGA and disk drive unit with such a micro-actuator.
    Type: Grant
    Filed: July 29, 2005
    Date of Patent: May 19, 2009
    Assignee: SAE Magentics (H.K.) Ltd.
    Inventors: MingGao Yao, Masashi Shiraishi
  • Patent number: 6758722
    Abstract: An integrated lapping guide (ILG) is described including at least one read-head and an electronic lapping guide (ELG). In one embodiment, the ELG is offset from the height of the read-head. Resistance between the read-head and the ELG can be measured during the lapping process. During the initial phase of the lapping process, the ELG dominates the change in ILG resistance and provides a long-range stripe-height control allowing for inclination and bending of the row of magneto-resistive (MR) heads. During the latter phases of the lapping process, the read-head dominates the change in ILG resistance and provides a short-range, uniform read-head resistance control. In this embodiment, the transition between the long-range stripe-height control and the short-range, uniform read-head resistance control is smooth, providing a marked benefit to the read-head manufacturing process.
    Type: Grant
    Filed: July 12, 2002
    Date of Patent: July 6, 2004
    Assignee: SAE Magentics, (H.K.) Ltd.
    Inventor: Li-Yan Zhu
  • Patent number: 6760194
    Abstract: A piezoelectric device comprises an integral body of piezoelectric material having a length and width greater than its thickness; wherein the device further includes, in contact with the body, respective pairs of electrodes, wherein the electrodes of each pair are opposed in the thickness direction, wherein the body deflects along said transverse direction when a voltage is applied to the electrode pair. The present invention further provisdes a disk drive suspension and a head gimbal assembly.
    Type: Grant
    Filed: February 19, 2003
    Date of Patent: July 6, 2004
    Assignee: SAE Magentics (H.K.) Ltd.
    Inventors: Masashi Shiraishi, Tamon Kasajima, Kai Wu, Zhihong Wang, Weiguang Zhu, Xi Yao