Patents Assigned to Sampson Taiwan Ltd.
  • Method for stacking semiconductor package units and stacked package
    Patent number: 6773959
    Abstract: A stacked package of semiconductor packaging units includes a direct electrical connection between leads of an upper semiconductor package unit, and includes direct electrical connections between selected leads of the upper semiconductor package unit and a lower semiconductor package unit. Leads of the upper semiconductor package unit are straightened, and chip-select and clock-enable leads are shortened and electrically connected to adjacent not-connected leads. Selected leads of the upper semiconductor package unit are electrically connected directly to underlying leads of the lower semiconductor packaging unit. Electrical connections preferably are solder connections.
    Type: Grant
    Filed: March 1, 2002
    Date of Patent: August 10, 2004
    Assignee: Sampson Taiwan Ltd.
    Inventor: Chad Yau
  • Method for stacking semiconductor package units and stacked package
    Publication number: 20030164539
    Abstract: A stacked package of semiconductor packaging units includes a direct electrical connection between leads of an upper semiconductor package unit, and includes direct electrical connections between selected leads of the upper semiconductor package unit and a lower semiconductor package unit. Leads of the upper semiconductor package unit are straightened, and chip-select and clock-enable leads are shortened and electrically connected to adjacent not-connected leads. Selected leads of the upper semiconductor package unit are electrically connected directly to underlying leads of the lower semiconductor packaging unit. Electrical connections preferably are solder connections.
    Type: Application
    Filed: March 1, 2002
    Publication date: September 4, 2003
    Applicant: SAMPSON TAIWAN LTD.
    Inventor: Chad Yau