Patents Assigned to Samsung Elecrtonics, Co., Ltd.
  • Publication number: 20240073414
    Abstract: Provided are video encoding/decoding methods and apparatuses for determining an intra prediction mode of a current block, based on a width and height of the current block. When the current block has a square shape in which the width and height are equal, the intra prediction mode of the current block is determined from among first intra prediction mode candidates including a plurality of predetermined intra prediction directions, and when the current block has a non-square shape in which the width and height are not equal, the intra prediction mode of the current block is determined from among second intra prediction mode candidates configured based on the non-square shape.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECRTONICS CO., LTD.
    Inventors: Narae CHOI, Minsoo PARK, Minwoo PARK, Seungsoo JEONG, Kiho CHOI, Woongil CHOI, Anish TAMSE, Yinji PIAO
  • Publication number: 20100297944
    Abstract: A multi-device control method and a related apparatus are provided for transmission of information between communication devices. In the method, a master device shares particular information with a serving device after accessing the serving device through a communication channel, including a human body. Then the master device measures signal strength of each of slave devices using the communication channel. The slave devices include the serving device. The master device selects one of the slave devices as a target device with relatively greater signal strength, and then transmits the information to the target device through the communication channel.
    Type: Application
    Filed: May 25, 2010
    Publication date: November 25, 2010
    Applicant: Samsung Elecrtonics Co., Ltd.
    Inventor: Jong Rim LEE
  • Patent number: 7037835
    Abstract: Provided are an interconnection of a semiconductor device which includes a capping layer and a method for forming the interconnection. The interconnection of the semiconductor device is a copper damascene interconnection where the capping layer is formed as a dual layer of a silicon nitride layer and silicon carbide layer on a copper layer processed by chemical mechanical polishing (CMP). Therefore, it is possible to maintain a high etching selectivity and a low dielectric constant of the silicon carbide layer while providing superior leakage suppression.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: May 2, 2006
    Assignee: Samsung Elecrtonics, Co., Ltd.
    Inventors: Kyoung-woo Lee, Soo-geun Lee, Ki-chul Park, Won-sang Song
  • Patent number: 6678152
    Abstract: A compartment assembly for a displaying apparatus is disclosed. An external signal input unit is installed in a portion of the compartment for receiving a video or audio signal generated from an outside of the displaying apparatus. The compartment assembly includes an opening formed on a front cover of the displaying apparatus, a support formed in an inner circumference of the front cover and disposed adjacent to the opening for supporting the external signal input unit, and a cover detachably coupled to the front cover for closing the opening. The cover includes a rib extended from a bottom of the cover so as to contact the external signal input unit for preventing the external signal input unit from moving when the cover closes the opening.
    Type: Grant
    Filed: November 8, 2001
    Date of Patent: January 13, 2004
    Assignee: Samsung Elecrtonics Co., Ltd.
    Inventor: Kwey-Hyun Kim