Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to first and second end surfaces of the ceramic body, having the dielectric layer therebetween, first and second electrode layers electrically connected to the first and second internal electrodes, respectively, a conductive resin layer formed on the first and second electrode layers and in regions of the ceramic body adjacent to the first and second electrode layers, and a coating layer formed between a portion of an outer surface of the ceramic body on which the conductive resin layer is to be formed and the conductive resin layer.

Abstract: Provided are a wafer level package and a wafer level packaging method, which are capable of performing an attaching process at a low temperature and preventing contamination of internal devices. In the wafer level package, a device substrate includes a device region, where a device is formed, and internal pads on the top surface. The internal pads are electrically connected to the device. A cap substrate includes a getter corresponding to the device on the bottom surface. A plurality of sealing/attaching members are provided between the device substrate and the cap substrate to attach the device substrate and the cap substrate and seal the device region and the getter. The sealing/attaching members are formed of polymer. A plurality of vias penetrate the cap substrate and are connected to the internal pads.

Abstract: The present invention relates to a method for manufacturing metal nanoparticles, more particularly to a method for manufacturing metal nanoparticles, which includes: preparing a mixed solution including capping molecules, a metal catalyst, a reducing agent, and an organic solvent; adding a metal precursor to the mixed solution and raising to a predetermined temperature and stirring; and lowering the temperature of the mixed solution and producing nanoparticles. Embodiments of the invention allow the synthesis of nanoparticles, such as of single metals, metal alloys, or metal oxides, to a high concentration in a water base using a metal catalyst.

Abstract: The present invention provides metal nanoparticles, containing copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.