Abstract: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and an external electrode disposed outside the body and connected to the internal electrode, in which the dielectric layer includes a plurality of dielectric crystal grains, and at least one of the plurality of dielectric crystal grains includes a core-shell structure including an inner core area and a shell area covering at least a portion of the core area, and 90% or more of the plurality of dielectric crystal grains satisfy an average size of 170.0 nm to 190.0 nm, and a maximum deviation of sizes of the dielectric crystal grains satisfies ±60.0 nm compared to an average size of the dielectric crystal grains.

Abstract: A multilayer electronic component includes: a body having a dielectric layer and first and second internal electrodes alternately disposed with each other while having the dielectric layer interposed therebetween in a first direction; and an external electrode including a connection portion and a band portion extending from the connection portion onto first and second surfaces of the body, wherein the external electrode further includes an electrode layer connected to one of the first and second internal electrodes, a resin layer in contact with the first and second surfaces, and a conductive resin layer disposed on the electrode layer and extending to the resin layer, and L1??L1 when L1 indicates a second-directional size of the resin layer in the band portion, and L1? indicates a second-directional size of the conductive resin layer in the band portion.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens, disposed in order from an object side, and a first reflection member and a second reflection member, disposed on an object side of the first lens, each having a freeform surface.

Abstract: A multilayer ceramic capacitor includes a ceramic body having a dielectric layer, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion arranged on end portions of the internal electrodes exposed through respective opposing surfaces of the ceramic body. The ceramic body includes an active portion having the plurality of internal electrodes arranged to overlap each other with the dielectric layer interposed therebetween to form capacitance, and cover portions disposed above an uppermost and below a lowermost internal electrode of the active portion. The first and second side margin portions include tin (Sn), and a content of Sn included in the first and second side margin portions is greater than a content of Sn included in the dielectric layer of the active portion.

Abstract: A band pass filter includes a resonator including a first inductor and a first capacitor coupled in series between a first port and a second port, a second inductor coupled in parallel with the resonator, a second capacitor coupled in parallel with the resonator, and a third capacitor coupled between one end of the second capacitor and the ground to perform a low pass filter function.

Abstract: A film for manufacturing an electronic component includes a polymer layer and conductive nanowires and magnetic nanoparticles dispersed in the polymer layer.

Abstract: A substrate includes: a first insulating layer; a second insulating layer disposed on the first insulating layer; and a via hole including a lower hole formed in the first insulating layer, and an upper hole formed in the second insulating layer and connected to the lower hole, in which a width of an upper side of the lower hole is larger than a width of a lower side of the lower hole, and a width of an upper side of the upper hole is larger than a width of a lower side of the upper hole.

Abstract: A printed circuit board includes: a first board unit including a plurality of first insulating layers and a plurality of first wiring layers respectively disposed on or in the plurality of first insulating layers; a second board unit including one or more second insulating layers and one or more second wiring layers respectively disposed on or in the one or more second insulating layers; and a first passive device embedded in at least one of the first and second board units. The second board unit is disposed on the first board unit, and the first board unit has a second cavity passing through at least a portion of the plurality of first insulating layers on the first passive device based on a stacking direction of the plurality of first wiring layers.

Abstract: An optical imaging system includes an optical system including at least six lenses, sequentially disposed from an object side toward an image side, an image sensor configured to convert light incident through the optical system into an electronic signal, and a variable stop configured to change an incident hole diameter and disposed toward the object side of a lens of the optical system closest to the object side, wherein TTL is a distance to an imaging plane of the image sensor from an object-side surface of the lens closest to the object side and 4.7 mm <TTL <6.00 mm, and wherein Ri is a radius of curvature of an object-side surface of a lens of the optical system second closest to the image sensor, Rj is a radius of curvature of an image-side surface of the lens that is second closest to the image sensor, and ?0.5<(|Ri|?|Rj|)/(|Ri|?|Rj|)/(|Ri|+|Rj|)<0.5.

Abstract: A circuit board including: an insulation layer having a first surface and a second surface facing each other; a first pad layer including a first connection pad and a first conductive layer stacked on the first connection pad, a portion of the first pad layer buried in the insulation layer, and another portion of the first pad layer protruding from a first surface of the insulation layer; and a second conductive layer disposed on the first conductive layer.

Abstract: An actuator for optical image stabilization includes a fixed frame having an internal space; a moving frame disposed in the fixed frame and configured to be movable relative to the fixed frame; a first driving unit including a plurality of magnets disposed on the fixed frame, and a plurality of coils disposed on the moving frame and configured to be movable together with the moving frame relative to the fixed frame; and a sensor substrate including a moving part coupled to the moving frame and configured to be movable together with the moving frame relative to the fixed frame; and an extension substrate extending from one side of the sensor substrate and covering a portion of at least one surface of the fixed frame, wherein an image sensor is disposed on the moving part of the sensor substrate, and a control unit is disposed on the extension substrate.

Abstract: A manufacturing method for a printed circuit board includes: forming a first substrate portion; forming an intermediate insulating layer on the first substrate portion; forming a temporary layer on a surface opposite to a surface on which the intermediate insulating layer of the first substrate portion is formed; flattening the temporary layer; forming a second substrate portion on the intermediate insulating layer; and removing the temporary layer.

Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. A region, containing nickel (Ni) and carbon (C), is present between the internal electrode layer and the dielectric layer.

Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in ascending numerical order along an optical axis from an object side of the optical imaging system toward an imaging plane of an image sensor, wherein TTL/(2*IMG HT)?0.67 is satisfied, where TTL is a distance along the optical axis from an object-side surface of the first lens to the imaging plane of the image sensor, and IMG HT is one half of a diagonal length of the imaging plane of the image sensor, and 15<v1-v3<45 is satisfied, where v1 is an Abbe number of the first lens, and v3 is an Abbe number of the third lens.

Abstract: A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage. The internal electrode may include a plurality of conductor portions and a plurality of cut-off portions.

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and internal electrodes; and an electrode layer disposed on the body and connected to the internal electrodes; and the electrode layer includes Cu particles and glass, wherein oxides including Cu is disposed on at least a portion of the interface between the Cu particles and the glass.

Abstract: A method of manufacturing a multilayer electronic component including: a first operation of obtaining a layer pattern constituting one layer by performing at least one of a process of forming a dielectric pattern by ejecting a ceramic ink containing a dielectric material and a photocurable resin, a process of forming an internal electrode pattern by ejecting a first metal ink containing conductive particles for internal electrodes and a photocurable resin, and a process of forming external electrode patterns by ejecting a second metal ink containing conductive particles for external electrodes and a photocurable resin; a second operation of obtaining a cured layer pattern by irradiating the layer pattern with ultraviolet light to cure the layer pattern; obtaining a laminate in which a plurality of cured layer patterns are stacked by carrying out a plurality of the first and second operations; and sintering the laminate.

Abstract: A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction and a cover portion disposed on one surface and the other surface of the capacitance forming portion in the first direction, and external electrodes disposed on the body, wherein a secondary phase including Al is disposed at an interface between the internal electrode and the dielectric layer, and the ratio of an area occupied by the secondary phase to an area of the capacitance forming portion is 0.03% or more and 0.40% or less.

Abstract: A multilayer electronic component including: a body including a capacitance formation portion, cover portions disposed on surfaces on the capacitance formation portion opposing each other in one direction, and margin portions disposed on surfaces of the capacitance formation portion opposing each other in another direction; a first external electrode; a second external electrode, and the cover portions include a first-first buffer layer connected to the first external electrode and a first-second buffer layer connected to the second external electrode, and the margin portions include a second-first buffer layer connected to the first external electrode and a second-second buffer layer connected to the second external electrode, and the first-first buffer layer and the second-first buffer layer are connected to each other, and the first-second buffer layer and the second-second buffer layer are connected to each other.