Patents Assigned to SANG FANG CHEMICAL INDUSTRY CO., LTD.
  • Publication number: 20090258316
    Abstract: The present invention relates to a method for patterning a covering material by using a high-power exciting beam. The method includes the steps of (a) providing a base material having a plurality of thin layers, the neighboring thin layers having different colors; and (b) utilizing a high-power exciting beam to form at least one pattern on the base material, in which the pattern has at least one concave portion, so as to expose the thin layers with different colors. As a result, the covering material has a layered visual effect and many colors. Furthermore, the patterning method of the present invention is simple, and can form the pattern on the base material easily Therefore, the manufacturing time of the covering material with the pattern is reduced.
    Type: Application
    Filed: August 12, 2008
    Publication date: October 15, 2009
    Applicant: SANG FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih FENG, Chun-Ta WANG, Yung-Chang HUNG, Wei-Te LIU, I-Peng Yao
  • Publication number: 20090041997
    Abstract: A PU composite and a method of fabricating the same are provided. The fabrication method includes: (a) providing a release paper; (b) coating a fabric layer on the release paper, the fabric layer containing a PU resin, an abrasion resistant, and a colorant; (c) drying the fabric layer; (d) coating a first laminated layer on the fabric layer; (e) drying the first laminated layer; (f) laminating a wet PU foam layer on the first laminated layer; (g) releasing the release paper to form a semi-product; (h) providing a plastic layer, which is of a thermoplastic; (i) coating a second laminated layer on the plastic layer; (j) drying the second laminated layer; and (k) laminating the semi-product of Step (g) on the second laminated layer, so as to form a PU composite. Compared with conventional PU composites, the PU composite of the present invention has better UV resistance, solvent resistance, and abrasion resistance.
    Type: Application
    Filed: January 14, 2008
    Publication date: February 12, 2009
    Applicant: SANG FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Ko-Feng Wang, Chen-Tai Cheng, Kai-Feng Kang
  • Publication number: 20080287047
    Abstract: The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
    Type: Application
    Filed: May 18, 2007
    Publication date: November 20, 2008
    Applicant: SANG FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, CHEN-HSIANG CHAO, YUNG-CHANG HUNG
  • Publication number: 20080220702
    Abstract: The present invention relates to a polishing pad having a surface texture. The surface texture is disposed on the polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove extends from a central portion of the polishing pad to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. The holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove. Thus, the second groove(s) enables impurities suspended in the polishing slurry to be quickly removed from the polishing pad, and the holes can store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
    Type: Application
    Filed: May 21, 2008
    Publication date: September 11, 2008
    Applicant: SANG FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih FENG, I-Peng YAO, Chen-Hsiang CHAO, Kun-Cheng SUNG