Abstract: A molded circuit board is formed by a process comprising the steps of: molding liquid crystal polymer of plating grade into a primary molded member which outline corresponds to the dimensions of the molded circuit board; roughening the surface of the primary molded member; molding a secondary molded member by coating the primary molded member with oxyalkylene-containing poly(vinyl alcohol) resin over the surface thereof except for a portion thereof on which a circuit is to be formed; heating the first and secondary molded members; applying catalyst to the portion of the surface of the primary molded member not covered by the secondary molded member; heating the first and secondary molded members in hot water to elute the secondary molded member; and chemically plating the catalyst-applied-portion to form the circuit thereon, by which the size of the molded circuit board is minimized with simple procedures and production cost reduced.

Abstract: After forming a conductive layer on the entire surface of an insulation substrate, a resin mask of poly lactic acid etc. resin which will hydrolyze in an alkali aqueous solution is integrally formed on the insulation substrate so that a part to which a conductive layer of a predetermined pattern is to be formed is exposed. Then, a conductive layer is overlaid on the part exposed from the resin mask by means of electrolytic plating using an acidic bath composition. The interface between the resin mask of poly lactic acid etc. resin and the conductive layer reproduces an accurate contour of the pattern. Thereafter, the resin mask is efficiently removed by hydrolysis using an alkali aqueous solution, and finally the conductive layer is removed by chemical etching to thereby form a conductive layer having the predetermined pattern on the surface of the insulation substrate.

Abstract: After forming a conductive layer on the entire surface of an insulation substrate, a resin mask of poly lactic acid etc. resin which will hydrolyze in an alkali aqueous solution is integrally formed on the insulation substrate so that a part to which a conductive layer of a predetermined pattern is to be formed is exposed. Then, a conductive layer is overlaid on the part exposed from the resin mask by means of electrolytic plating using an acidic bath composition. The interface between the resin mask of poly lactic acid etc. resin and the conductive layer reproduces an accurate contour of the pattern. Thereafter, the resin mask is efficiently removed by hydrolysis using an alkali aqueous solution, and finally the conductive layer is removed by chemical etching to thereby form a conductive layer having the predetermined pattern on the surface of the insulation substrate.

Abstract: A molded circuit board is formed by a process comprising the steps of: molding liquid crystal polymer of plating grade into a primary product that has an outline corresponding to the dimensions of said molded circuit board; roughening the surface of said primary product; molding a secondary molded member to produce a secondary product by coating said primary molded member with oxyalkylene-containing poly(vinyl alcohol) resin over almost the entire surface thereof except for a circuit area on which a circuit is to be formed; heating said secondary product; applying catalyst to said circuit area where portions of surface of said primary molded member are not covered with said secondary molded member; heating said secondary product in hot water to elute the secondary molded member into hot water; and chemically plating the catalyst-applied-area to form a circuit thereon. This process minimizes the size of the molded circuit board, simplifies the procedure and thus reduce the production cost.

Abstract: An electronic part having a complicated internal configuration is integrally molded without dividing the configuration into a plurality of sections, thereby reducing the cost and improving the quality of the electronic part.

Abstract: An electronic part, which has a complicated internal configuration and has a movable part rotatably and movably accommodated therein, is integrally molded without dividing the configuration into a plurality of sections to carry out a number of molding operations for separate sections of the electronic part, thereby reducing the cost and enhancing the quality of the electronic part.

Abstract: To provide a resin molding method and apparatus that may realize a sprue runnerless system with a very simple structure and at a low cost, a molten resin 4 is fed from a resin supply portion 1 into a pair of cavities 3 through a resin passages 2 such as a sprue portion 2A and a pair of runner portion 2B for molding the resin. The method includes the following steps of: moving a resin return member 5 toward the resin supply portion 1 after supplying the molten resin 4 into the cavities 3, the resin return member 5 being disposed so as to be projectable into the resin passage 2 and movable through the resin passage 2; and returning a waste molded resin 6 under a molten/solid condition within the resin passage 2 back into the resin supply portion 1 under a molten condition by a heat of the resin supply portion 1.

Abstract: This invention relates to a partially plated molded article and to a process for the production of a molded article which is partially plated with metal such as circuit boards, connectors, decorative articles, etc., where a catalyst such as palladium, gold, etc. is added after roughening of the surface of a primary molded article, and then, the molded article is inserted into the mold and a secondary article molded thereabout so that the portions to be plated with metal are exposed, and after such molding, the exposed portions are plated with metal. Alternatively, the catalyst may be applied after molding of the secondary article around the roughened primary molded article.

Abstract: This invention relates to a partially plated molded article and to a process for the production of a molded article which is partially plated with metal such as circuit boards, connectors, decorative articles, etc., where a catalyst such as palladium, gold, etc. is added after the roughing of the surface of the primary molded article, and then, the molded article is inserted into the mold and molded so that the portions to be plated with metal are exposed, and after such molding, the exposed portions are plated with metal.

Abstract: This invention relates to a process for the production of a molded article partially plated with metal as in the case of circuit boards, connectors, decorative articles, etc., where a catalyst such as palladium, gold, etc. is added after roughening of the surface of the primary molded article, and then, the molded article is inserted into the mold and molded so that the portions to be plated with metal are exposed outwardly, and after such molding, the secondary molded material is plated with metal.

Abstract: A process for the production of a molded article such as a circuit board and the like includes applying catalyst such as palladium, gold, etc. to a primary molded article after roughening of its surfaces, then, after such pre-treatment, the primary molded article is set into a mold to form a secondary molded article covered with cover material only leaving a portion to be subjected to metal plating, and then the secondary molded article is removed from the mold and subjected to metal plating, and finally the cover material is removed after metal plating.