Abstract: A tiled display structure is fabricated on a single substrate that also serves as a circuit board containing electronic components. Electrodes are formed on the substrate and the remainder of the display section is formed on the electrodes. The pixel elements use patterned display material, and occupy only a portion of the pixel structure. The electronic components are mounted on the substrate using exceptionally long leads to assist in thermal management of tiles. Alternatively, each tile includes a fin structure on the circuit board surface onto which electronic components are mounted and are not in contact with the substrate. Alternatively, each tile includes a flexible circuit board mounted on the substrate, a portion of which is bent away from the substrate. Electronic components are coupled to this portion of the flexible circuit boards such that the components are not in contact with the substrate to assist in thermal management.

Abstract: Embedded passive components such as capacitors are formed in multilayer ceramic circuit boards by screen printing a component precursor compound ink sandwiched between conductor ink layers onto a green tape stack and covering the component ink layer with one or two green tape layers, aligning and laminating the green tapes and firing. Capacitor inks are made from dielectrics chosen from barium titanate, titanium oxide and lead-magnesium-niobate. The green tapes are made of a mixture of a crystallizing glass, a non-crystallizing glass and an oxide filler which does not shrink in the x and y dimensions during firing mounted on a metal support. Thus the embedded components can be made to close tolerances.