Patents Assigned to Sayama Kako Co., Ltd.
  • Patent number: 5020830
    Abstract: A sealed card comprises a card substrate and a cover sheet disposed over the surface of the card substrate for sealing the substrate, wherein a transparent resin film having a thin transferable membrane with a hiding power releasably deposited thereon is put between the card substrate and the cover sheet by a transparent pressure sensitive adhesive layer and another pressure sensitive adhesive layer, respectively. The card surface is usually covered and concealed by the cover sheet and the thin transferable membrane and can be read through the transparent resin film by easily peeling the cover sheet together with the thin transferable member from the surface of the resin film. The sealed card can be manufactured easily.
    Type: Grant
    Filed: January 26, 1990
    Date of Patent: June 4, 1991
    Assignee: Sayama Kako Co., Ltd.
    Inventor: Shigenari Shishido
  • Patent number: 4742954
    Abstract: A postal card having a cover sheet releasably bonded to the printed surface of a card substrate, comprising a card substrate on which secret contents are printed, a transparent protection film made of a thermoplastic resin bonded by means of adhesive layer to the printed surface of the card substrate, a cover sheet applied with a lamination film made of a thermoplastic resin different from the thermoplastic resin for the protection film, and a coupling layer made of the same kind of the thermoplastic resin as that for the lamination film and supplied between the protection film and the lamination film while heated to a temperature within a range from the softening point to the melting point of the resin for releasably coupling the protection film and the lamination film, in which the protection film, the coupling layer and the lamination film are firmly secured with each other at a fixing area and a releasing area is formed at another portion of the outer peripheral region.
    Type: Grant
    Filed: June 26, 1987
    Date of Patent: May 10, 1988
    Assignee: Sayama Kako Co., Ltd.
    Inventor: Shigenary Shishido