Abstract: An electronic component enclosure comprises an outer frame and an inner frame, with the outer and inner frames forming a plenum therebetween. A cooling facility such as an HVAC unit is fluidly coupled to the electronic component enclosure's plenum. The cooling facility is controlled by a control system configured to adjust at least one property of fluid flowing through the plenum, such as its flow rate and/or temperature. Alternatively, a cooling system can comprise a plurality of electronic component enclosures such that a control system can be configured to adjust at least one property of fluid flowing through each electronic component enclosure's respective plenum.