Abstract: Apparatus and methods are provided for handling packaged integrated circuits (IC's), particularly for inserting packaged IC's in and removing packaged IC's from low-insertion-force (LIF) sockets. The apparatus includes a precisor having a chip precisor feature for receiving an IC package and a socket precisor feature for receiving a socket in a predetermined alignment relative to the chip precisor feature. One or more releasable chip retainers are provided, such as a vacuum nozzle for pulling the packaged IC into a seated position within the chip precisor feature and a pair of gripper fingers for holding the packaged IC within the chip precisor feature during extraction from a LIF socket.
Type:
Application
Filed:
June 29, 2001
Publication date:
November 22, 2001
Applicant:
SCHLUMBERER TECHNOLOGIES INC.
Inventors:
Jeffery Martin, Dave Searfoss, Raymond E. Zeune