Abstract: A miniature audio earphone includes a pair of audio earphones, an electrical connector adapted for making a selectively detachable physical and electrical connection to a source of stereo audio signals, a generally Y-shaped electrical lead assembly having a bifurcated upper portion and an adjoining lower portion, whose lower end is coupled to the connector. The upper portion has a pair of branch leads each of which is coupled to a respective one of said earphones. A plurality of exteriorly disposed mechanical shielding elements at least partially surrounds an underlying portion of at least one of said branch leads to resist damage to the lead assembly due to abrasion, crushing, kinking and cutting without unduly impairing the flexibility of the assembly or causing it to have an unattractive appearance. A tensile stress-relief line is also provided for resisting damage to the upper portion of the assembly due to tension.