Abstract: A thermoelectric element (1) comprises a partitioning plate (2) having electrical insulating properties; equal numbers of p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B) fixed to the partitioning plate (2) in a state in which they pass through the partitioning plate (2); flat copper electrodes (4) fixed to upper sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B); and T-shaped copper electrodes (5) fixed to lower sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B). Lower portions protruding from the lower surface of the partitioning plate (2) are accommodated within a cooling vessel and are cooled directly by a coolant or air.