Patents Assigned to Semiconductor Manfacturing International (Beijing) Corp.
  • Patent number: 10483263
    Abstract: The present disclosure provides a semiconductor device and a manufacturing method therefor.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: November 19, 2019
    Assignees: Semiconductor Manufacturing International (Shanghai) Corp., Semiconductor Manfacturing International (Beijing) Corp.
    Inventor: Fei Zhou