Patents Assigned to Semsysco GmbH
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Patent number: 11965263Abstract: The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a corresponding method. The system comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element.Type: GrantFiled: September 2, 2020Date of Patent: April 23, 2024Assignee: SEMSYSCO GMBHInventors: Herbert Ötzlinger, Oliver Knoll, Raoul Schröder, Markus Gersdorff, Thomas Wirnsberger, Georg Hofer, Andreas Gleissner
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Patent number: 11942356Abstract: The disclosure relates to a clipping mechanism for fastening a substrate for a surface treatment of the substrate, a clipping module for holding a substrate for a surface treatment of the substrate and a method for assembling a clipping mechanism for fastening a substrate for a surface treatment of the substrate. The clipping mechanism for fastening a substrate for a surface treatment of the substrate comprises a clipping bracket and an actuation unit. The clipping bracket comprises in a cross-section a first arm and a second arm. The first arm is moveable relative to the second arm to a receiving position for the substrate with a receiving distance between the first arm and the second arm. The first arm is moveable relative to the second arm to a fastening position for the substrate with a fastening distance between the first arm and the second arm. The fastening distance is smaller than the receiving distance. The actuation unit is at least partially surrounded by the clipping bracket.Type: GrantFiled: October 12, 2021Date of Patent: March 26, 2024Assignee: SEMSYSCO GMBHInventors: Andreas Gleissner, Ulrich Tschinderle
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Patent number: 11938522Abstract: The invention relates to a module for chemically processing a substrate, a method for chemically processing a substrate and a use of a module for chemically processing a substrate and in particular a large substrate. The module for chemically processing a substrate comprises: an immersion chamber, a spray unit, and a motion unit (14). The immersion chamber is configured to receive a first liquid and the substrate, so that the substrate is immersed in the liquid. The spray unit comprises a plurality of spray nozzles, which are configured to spray a second liquid within the immersion chamber. The motion unit is configured to provide a relative motion between the substrate and the spray unit.Type: GrantFiled: December 1, 2020Date of Patent: March 26, 2024Assignee: SEMSYSCO GMBHInventors: Andreas Gleissner, Herbert Ötzlinger, Raoul Schröder, Oliver Knoll
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Patent number: 11908698Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: Providing a substrate with a substrate surface comprising at least one recess, applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and plating the recess.Type: GrantFiled: October 1, 2021Date of Patent: February 20, 2024Assignee: SEMSYSCO GMBHInventors: Franz Markut, Thomas Wirnsberger, Oliver Knoll, Andreas Gleissner, Harald Okorn-Schmidt, Philipp Engesser
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Patent number: 11566337Abstract: Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.Type: GrantFiled: October 6, 2020Date of Patent: January 31, 2023Assignee: Semsysco GmbHInventors: Andreas Gleissner, Thomas Wirnsberger, Herbert Ötzlinger
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Publication number: 20220020591Abstract: The teaching relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate includes the following: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.Type: ApplicationFiled: October 1, 2021Publication date: January 20, 2022Applicant: SEMSYSCO GMBHInventors: Franz Markut, Thomas Wirnsberger, Oliver Knoll, Andreas Gleissner, Harald Okom-Schmidt, Philipp Engesser
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Patent number: 11136687Abstract: Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.Type: GrantFiled: July 24, 2018Date of Patent: October 5, 2021Assignee: Semsysco GmbHInventors: Andreas Gleissner, Thomas Wimsberger, Herbert Ötzlinger
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Patent number: 11105014Abstract: An exemplary distribution system, apparatus and method can be provide for chemical and/or electrolytic surface treatment of a substrate in a process fluid. The distribution system can comprise a distribution body and a control unit. The distribution body can be configured to direct a flow of the process fluid and/or an electrical current to the substrate. The distribution body can comprise at least a first distribution element and a second distribution element. The control unit/device can be configured to control the first distribution element and the second distribution element separately from one another.Type: GrantFiled: July 24, 2018Date of Patent: August 31, 2021Assignee: SEMSYSCO GMBHInventors: Andreas Gleissner, Franz Markut, Herbert Ötzlinger
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Publication number: 20190228975Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.Type: ApplicationFiled: January 24, 2019Publication date: July 25, 2019Applicant: Semsysco GmbHInventors: Franz Markut, Thomas Wirnsberger, Oliver Knoll, Andreas Gleissner, Harald Okorn-Schmidt, Philipp Engesser