Patents Assigned to Sendo B.V.
  • Sensor package and a method of manufacturing a sensor package
    Patent number: 11092505
    Abstract: A sensor package 1 includes a sensor carrier 2 with a sensor element 4, a pre-moulded tray part 10 with an exposed cavity 12, the sensor carrier 2 with the sensor element 4 being positioned in a recess 21 of the pre-moulded tray part 10 part to extend into the exposed cavity 12. A lead frame 6 is arranged to provide external connections of the sensor package 1, an over-moulding package part 8, arranged around the lead frame 6 and the pre-moulded tray part 10 and having an aperture 12a aligned with the exposed cavity 12.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: August 17, 2021
    Assignee: Sendo B.V.
    Inventors: Ignatius Josephus van Dommelen, Johannes Mathias Nicolaas Pleumeekers