Patents Assigned to Senju System Technology Co., Ltd.
  • Soldering device and control method for soldering device
    Patent number: 11697169
    Abstract: A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: July 11, 2023
    Assignees: DENSO TEN Limited, SENJU SYSTEM TECHNOLOGY CO., LTD.
    Inventors: Hisaki Hayashi, Yasuyuki Watanabe, Noboru Hashimoto
  • Soldering method and soldering apparatus
    Patent number: 11059117
    Abstract: To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput. Provided is a soldering method including preheating a mask on which a substrate is not placed, placing the substrate on the preheated mask, and bringing at least a part of the substrate placed on the preheated mask into contact with molten solder and thus soldering the substrate.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: July 13, 2021
    Assignees: SENJU METAL INDUSTRY CO., LTD., SENJU SYSTEM TECHNOLOGY CO., LTD.
    Inventors: Noboru Hashimoto, Takahiro Kasama
  • SOLDERING DEVICE AND CONTROL METHOD FOR SOLDERING DEVICE
    Publication number: 20200398359
    Abstract: A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.
    Type: Application
    Filed: June 18, 2020
    Publication date: December 24, 2020
    Applicants: DENSO TEN Limited, Senju System Technology Co., Ltd.
    Inventors: Hisaki HAYASHI, Yasuyuki WATANABE, Noboru HASHIMOTO
  • SOLDERING METHOD AND SOLDERING APPARATUS
    Publication number: 20200254549
    Abstract: To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput. Provided is a soldering method including preheating a mask on which a substrate is not placed, placing the substrate on the preheated mask, and bringing at least a part of the substrate placed on the preheated mask into contact with molten solder and thus soldering the substrate.
    Type: Application
    Filed: November 26, 2019
    Publication date: August 13, 2020
    Applicants: SENJU METAL INDUSTRY CO., LTD., Senju System Technology Co., Ltd.
    Inventors: Noboru HASHIMOTO, Takahiro KASAMA