Patents Assigned to SenseSonics, Inc.
  • Patent number: 4852177
    Abstract: A high fidelity earphone or hearing aid utilizes an acoustic path from a location near where the sound is delivered to the ear, to a location near the backside of the sound-producing diaphragm. A vent to the atmosphere from a location near the backside of the sound-producing diaphragm is also taught. A microphone on the earphone makes it safe to listen to the radio or a tape player in public, because of the capability of hearing outside sounds.
    Type: Grant
    Filed: August 28, 1986
    Date of Patent: July 25, 1989
    Assignee: SenseSonics, Inc.
    Inventor: Stephen D. Ambrose