Patents Assigned to SENSOR HOLDINGS LIMITED
  • Patent number: 11892487
    Abstract: In one aspect the invention provides a sensing apparatus comprising a set of N capacitive sensors connected over a single physical channel provided by two terminals, the apparatus comprising: a sensing array having a first capacitive sensor and N?1 parallel capacitive sensors each connected in parallel with first capacitive sensor, each capacitive sensor having electrodes separated by a dielectric to provide a capacitance which is able to vary with deformation to provide sensing, the array having a set of N?1 resistances each being in series with a respective one of the N?1 parallel capacitive sensors; a solution module operable to determine the capacitance of each capacitive sensor by finding solutions for a vector function equating reactance measured at the two terminals to an analytical model for impedance and/or reactance of the circuit seen at the two terminals, wherein the analytical model comprises N capacitances, each connected in parallel with each other, and comprises N series resistances each conne
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: February 6, 2024
    Assignee: SENSOR HOLDINGS LIMITED
    Inventors: Iain Alexander Anderson, Andreas Tairych
  • Patent number: 11835402
    Abstract: In one aspect the invention provides a soft electronic component having a signal electrode and one or more shielding electrodes overlapping the signal electrode to shield the signal electrode, wherein the soft electronic component is arranged to provide one or more signal-coupling regions in which the signal electrode is exposed by the one or more shielding electrodes to allow capacitive coupling of the signal electrode to a signal electrode of another component, wherein the one or more shielding electrodes are arranged to provide one or more shield-coupling regions to allow the capacitive coupling of a shielding electrode to the other component, and wherein the coupling region is covered by a dielectric material.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: December 5, 2023
    Assignee: SENSOR HOLDINGS LIMITED
    Inventor: Christopher Robert Walker
  • Patent number: 11825605
    Abstract: One aspect of the invention provides an interconnect between a stretchable electronic element and a circuit on a rigid or flexible printed circuit board (PCB Circuit), the stretchable electronic element is operable to be mechanically coupled to a substrate which deforms, and the stretchable electronic element will deform with the substrate and may or may not change an electrical characteristic as a result, the stretchable electronic element comprising one or more electrical pathways; the PCB Circuit configured to communicate electronically with the stretchable electronic element and comprising at least one circuit board extending from the stretchable electronic element to an electrical circuit on the PCB Circuit; wherein the interconnect comprises an electrical coupling between the electrical pathways of the stretchable electronic element and the PCB Circuit; and wherein the interconnect simultaneously prevents the connection between the stretchable electronic element from failing when the stretchable substra
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: November 21, 2023
    Assignee: Sensor Holdings Limited
    Inventors: Todd Alan Gisby, Llewellyn Adair Sims Johns, Andrew Thomas Wong, Felix Qing-Song Lun, Paul Malcolm Guininbert, Jeremy Labrado, Lewis Freeth Harpham, Elodie Lyath Bouzbib
  • Patent number: 10539475
    Abstract: In one embodiment the invention provides an interconnection component operable to interconnect a stretchable sensing component and cable for a sensing circuit. The interconnection component has a flexible circuit board comprising conductive regions to electrically connect to conductive layers of a sensor component overlaying the circuit. The flexible circuit board of one embodiment comprises engagement features to allow the sensor cast over the component to engage the flexible circuit board.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: January 21, 2020
    Assignee: SENSOR HOLDINGS LIMITED
    Inventors: Todd Alan Gisby, Andrew Thomas Wong, Llewellyn Adair Sims Johns