Abstract: A novel pressure measurement apparatus for measuring fluid pressures generated within a fluid passageway is disclosed. The apparatus includes a semiconductor pressure transducer which is mounted to a chip carrier comprised of a ceramic substrate layer. The semiconductor pressure transducer is reverse mounted to the substrate layer by way of a series of electrically conductive epoxy bond points. The semiconductor pressure transducer is enclosed within a gel cap containing an incompressible gel medium. Fluid pressures generated within the fluid passageway are communicated to the transducer via the gel medium.