Patents Assigned to Sentronics Corporation
  • Patent number: 6694269
    Abstract: A low cost capacitive fingerprint sensor which can be fabricated on various substrates, such as large glass or plastic substrates. The sensor is made by depositing and patterning alternate layers of conductive and insulation materials. A pixel of the sensor is comprised of a pick up pad and a plurality of voltage electrodes symmetrically placed around the pick up pad. The symmetry is such that only when a finger surface ridge is present, the pick up pad registers a signal.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: February 17, 2004
    Assignee: Sentronics Corporation
    Inventors: Robert S. Hayes, Gregory S. Um
  • Patent number: 6525547
    Abstract: A two dimensional array of electrods for sensing the presence or absence of the ridges in a fingerprint through capacitive measurements. Exciting signals are supplied from outside the array which allows the array to be fabricated from metal and insulator layers on non-semiconductor substrates such as glass or plastic using normal deposition and patterning techniques. A top protective layer consisting of hard, rigid material may be provided. The required electronic circuits are preferably located around the periphery of the array.
    Type: Grant
    Filed: April 17, 2001
    Date of Patent: February 25, 2003
    Assignee: Sentronics Corporation
    Inventor: Robert S. Hayes
  • Publication number: 20020156593
    Abstract: A low cost capacitive fingerprint sensor which can be fabricated on various substrates, such as large glass or plastic substrates. The sensor is made by depositing and patterning alternate layers of conductive and insulation materials. A pixel of the sensor is comprised of a pick up pad and a plurality of voltage electrodes symmetrically placed around the pick up pad. The symmetry is such that only when a finger surface ridge is present, the pick up pad registers a signal.
    Type: Application
    Filed: April 23, 2001
    Publication date: October 24, 2002
    Applicant: Sentronics Corporation
    Inventors: Robert S. Hayes, Gregory S. Um
  • Publication number: 20020152048
    Abstract: A two dimensional array of electrodes for sensing the presence or absence of the ridges in a fingerprint through capacitive measurements. Exciting signals are supplied from outside the array which allows the array to be fabricated from metal and insulator layers on non-semiconductor substrates such as glass or plastic using normal deposition and patterning techniques. A top protective layer consisting of hard, rigid material may be provided. The required electronic circuits are preferably located around the periphery of the array.
    Type: Application
    Filed: April 17, 2001
    Publication date: October 17, 2002
    Applicant: Sentronics Corporation
    Inventor: Robert S. Hayes
  • Patent number: 6429666
    Abstract: A compact sensor which maps fingerprints for identification purposes. The sensor consists of an array of pixels with each pixel configured with one or more pickup conductive electrodes surrounded by voltage electrodes of different phases. This configuration performs capacitive differencing to eliminate the large background capacitance without the need for complex sensor circuitry. In addition, the readout lines are electrically shielded from the input voltage lines by an intermediate grounded conductive layer, thereby eliminating the parasitic capacitance and allowing the detection of minute capacitance variation of the finger surface.
    Type: Grant
    Filed: April 17, 2000
    Date of Patent: August 6, 2002
    Assignee: Sentronics Corporation
    Inventor: Gregory S. Um